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At the time of the introduction of the Ambient Intelligence (AmI) concept many scenarios where considered to be visionary or even science fiction. Enabled by current technology, many aspects of these scenarios are slowly but inexorably becoming true. However, we are still facing important challenges that need further investments in research and industrialization. Current software engineering techniques and tools are not prepared to deal with the development of applications for what we could call AmI ecosystems, lacking a fixed architecture, controlled limits and even owners. The comfortable boundaries of static architectures and well-defined limits and owners are not existent in these AmI ecosystems. In its second year AmI.d again shows the heterogeneity of research challenges related to Ambient Intelligence. Many disciplines are involved and have to co-ordinate their efforts in resolving the strongly related research issues.
MEMS-based Circuits and Systems for Wireless Communications provides comprehensive coverage of RF-MEMS technology from device to system level. This edited volume places emphasis on how system performance for radio frequency applications can be leveraged by Micro-Electro-Mechanical Systems (MEMS). Coverage also extends to innovative MEMS-aware radio architectures that push the potential of MEMS technology further ahead. This work presents a broad overview of the technology from MEMS devices (mainly BAW and Si MEMS resonators) to basic circuits, such as oscillators and filters, and finally complete systems such as ultra-low-power MEMS-based radios. Contributions from leading experts around the...
The Industrial Electronics Handbook, Second Edition combines traditional and newer, more specialized knowledge that will help industrial electronics engineers develop practical solutions for the design and implementation of high-power applications. Embracing the broad technological scope of the field, this collection explores fundamental areas, including analog and digital circuits, electronics, electromagnetic machines, signal processing, and industrial control and communications systems. It also facilitates the use of intelligent systems—such as neural networks, fuzzy systems, and evolutionary methods—in terms of a hierarchical structure that makes factory control and supervision more ...
At a time when the human genome has been sequenced advances in the life sciences seem to have great potential for human health, industry and the environment throughout Central and Eastern Europe (CEE). Still, for some, potential risks and ethical dilemmas remain, surrounding issues such as the appropriate use of GM crops, stem cells, genetic information, the nature of intellectual property and other challenges that come with EU accession. This book is the first of its kind to bring together experts from across Europe to explore the landscape of current life science policy and industrial development in CEE, including implications for economies, regulatory and legal frameworks, health care, ethics and human rights. It will be essential reading for researchers and students in science and technology studies, development, sociology, politics and law, and those interested in life science development in transition economies.
This study summarises the discussions at a meeting, held in April 2002 and attended by representatives of European local and regional authorities, to consider key issues in relation to cities and regions in South-east Europe, including: economic needs and priorities; the promotion of small and medium sized businesses; transfrontier co-operation; and the role of local democracy associations.
Diane Stone addresses the network alliances or partnerships of international organisations with knowledge organisations and networks. Moving beyond more common studies of industrial public-private partnerships, she addresses how, and why, international organisations and global policy actors need to incorporate ideas, expertise and scientific opinion into their 'global programmes'. Rather than assuming that the encouragement for 'evidence-informed policy' in global and regional institutions of governance is an indisputable public good, she queries the influence of expert actors in the growing number of part-private or semi-public policy networks.
The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.