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The complete editorial contents of Qpedia Thermal eMagazine, Volume 2, Issues 1 - 12 features in-depth, technical articles on the most critical topics in the thermal management of electronics.
The complete editorial contents of Qpedia Thermal eMagazine, Volume 3, Issues 1 - 12 features in-depth, technical articles covering the most critical areas of electronics cooling.
The complete editorial contents of Qpedia Thermal 4, Issues 1 - 12 features 48 in-depth articles that discuss critical case studies, calculations and analysis for thermal engineering professionals and academia.
The complete editorial contents of Qpedia Thermal 5, Issues 1 - 12 features 48 in-depth articles that discuss case studies, emerging technologies, and fundamental thermal engineering calculations for the thermal management of electronics.
Advanced Analytic Control Techniques for Thermal Systems with Heat Exchangers presents the latest research on sophisticated analytic and control techniques specific for Heat Exchangers (HXs) and heat Exchanger Networks (HXNs), such as Stability Analysis, Efficiency of HXs, Fouling Effect, Delay Phenomenon, Robust Control, Algebraic Control, Geometric Control, Optimal Control, Fuzzy Control and Artificial Intelligence techniques. Editor Libor Pekar and his team of global expert contributors combine their knowledge and experience of investigated and applied systems and processes in this thorough review of the most advanced networks, analyzing their dynamics, efficiency, transient features, phy...
Nanofluid Applications for Advanced Thermal Solutions covers heat transfer applications of nanofluids in a variety of fields and the main techniques used in nanofluid flow and heat transfer analysis. The book features an introduction to heat transfer, nanofluid conduction, convection and nanofluid boiling and provides a thorough understanding of a variety of applications, including the energy storage component of solar PVT systems. It covers fundamental topics such as the analysis and measurement of thermophysical properties, convection, and heat transfer equipment performance, and provides a rigorous framework to assist readers in developing new nanofluid-based devices. Finally, the book ex...
The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionar...
Filled with careful explanations, step-by-step instructions, and useful examples, this handbook focuses on real-world considerations and applications of thermal measurement methods in electronics cooling. Fifteen experts in thermal engineering combine their expertise to create a complete guide to this complex topic. This practical reference covers all aspects of thermal characterization in electronics cooling and thermal management. The first part of the book introduces the concept of electronics cooling and its associated thermal phenomenon and explains why experimental investigation is required. Subsequent chapters explain methods of measuring different parameters and introduce relevant examples. Sources for locating needed equipment, tables, checklists, and to-do lists are included. Sample calculations and methodologies for error analysis ensure that you can put this valuable information to use in your work.
Advanced Heat Transfer, Second Edition provides a comprehensive presentation of intermediate and advanced heat transfer, and a unified treatment including both single and multiphase systems. It provides a fresh perspective, with coverage of new emerging fields within heat transfer, such as solar energy and cooling of microelectronics. Conductive, radiative and convective modes of heat transfer are presented, as are phase change modes. Using the latest solutions methods, the text is ideal for the range of engineering majors taking a second-level heat transfer course/module, which enables them to succeed in later coursework in energy systems, combustion, and chemical reaction engineering.
Thermal Design: Heat Sinks, Thermoelectrics, Heat Pipes, Compact Heat Exchangers, and Solar Cells, Second Edition, is a significantly updated new edition which now includes a chapter on thermoelectrics It covers thermal devices such as heat sinks, thermoelectric generators and coolers, heat pipes, and heat exchangers as design components in larger systems. These devices are becoming increasingly important and fundamental in thermal design across such diverse areas as microelectronic cooling, green or thermal energy conversion, and thermal control and management in space. The underlying concepts in this book cover the understanding of the physical mechanisms of the thermal devices with the essential formulas and detailed derivations, and also the design of the thermal devices in conjunction with mathematical modeling, graphical optimization, and occasionally computational-fluid-dynamic (CFD) simulation. This new edition includes more examples, problems and tutorials, and a solutions manual is available on a companion website.