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Adhesion Measurement of Films and Coatings
This book documents the proceedings of the Second International Symposium on Adhesion Measurement of Films and Coatings, held in Newark, NJ, October 25-27, 1999. Since the First Symposium (Boston 1992) there had been considerable activity in devising new, more reliable and more efficient ways to measure adhesion of films and coatings, which resulte
Advanced Topics in Materials Science and Engineering
This volume contains the papers presented at the First Mexico-U.S.A. Symposium on Materials Sciences and Engineering held in Ixtapa, Guerrero, Mexico, during Septem ber 24-27, 1991. The conference was conceived with the primary objective of increas ing the close ties between scientists and engineers in both Mexico and the U.S. with an interest in materials. The conference itself would have not taken place without the drive, determination and technical knowledge of John K. Tien of the University of Texas at Austin and of Francisco Mejia Lira of the Universidad de San Luis Potosi. This book is dedicated to their memory. The event brought together materials scientists and engineers with interes...
Ceramic Microstructures
This volume, titled Proceedings of the International Materials Symposium on Ce ramic Microstructures: Control at the Atomic Level summarizes the progress that has been achieved during the past decade in understanding and controlling microstructures in ceram ics. A particular emphasis of the symposium, and therefore of this volume, is advances in the characterization, understanding, and control of micro structures at the atomic or near-atomic level. This symposium is the fourth in a series of meetings, held every ten years, devoted to ceramic microstructures. The inaugural meeting took place in 1966, and focussed on the analysis, significance, and production of microstructure; the symposium e...
High Temperature Mechanical Behaviour of Ceramic Composites
High Temperature Mechanical Behavior of Ceramic Composites provides an up-to-date comprehensive coverage of the mechanical behavior of ceramic matrix composites at elevated temperatures. Topics include both short-term behavior (strength, fracture toughness and R-curve behavior) and long-term behavior (creep, creep-fatigue, delayed failure and lifetime). Emphasis is on a review of fundamentals and on the mechanics and mechanisms underlying properties. This is the first time that complete information of elevated temperature behavior of ceramic composites has ever been compacted together in a single volume. Of particular importance is that each chapter, written by internationally recognized experts, includes a substantial review component enabling the new material to be put in proper perspective. Shanti Nair is Associate Professor at the Department of Mechanical Engineering at the University of Massachusetts at Amherst. Karl Jakus is Professor at the University of Massachusetts at Amherst.
Progress in Nitrogen Ceramics
The first NATO Advanced Study Institute on Nitrogen Ceramics held in 1976 at Canterbury came at a particularly significant moment in the development of this subject. The five-year period, 1971-75, had been an especially fruitful one in very many respects for work in the areas of covalent materials in general, and of the nitrides in particular. The Institute was therefore able to cap ture fully the spirit of excitement and adventure engendered by the outputs of numerous national research programmes, as well as those of many smaller research groups, concerning ceramics potent ially suitable for applications in a high temperature engineering context. It reflected accurately the state of knowled...
Materials for Electronic Packaging
Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective. The last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems. Consists of 16 self-contained chapters, contributed by a variety of active researchers from industrial, academic and governmental sectors Addresses the need of materials scientists/engineers, electrical engineers, mechanical engineers, physicists and chemists to acquire a thorough knowledge of materials science Explains how the materials for electronic packaging determine the overall effectiveness of electronic systems
Comprehensive Structural Integrity
The aim of this major reference work is to provide a first point of entry to the literature for the researchers in any field relating to structural integrity in the form of a definitive research/reference tool which links the various sub-disciplines that comprise the whole of structural integrity. Special emphasis will be given to the interaction between mechanics and materials and structural integrity applications. Because of the interdisciplinary and applied nature of the work, it will be of interest to mechanical engineers and materials scientists from both academic and industrial backgrounds including bioengineering, interface engineering and nanotechnology. The scope of this work encomp...
Fracture of Engineering Materials and Structures
Recent advances in the field of fracture of engineering materials and structures have increasingly indicated its multidisciplinary nature. This area of research now involves scientists and engineers who work in materials science, applied mathematics and mechanics, and also computer scientists. The present volume, which contains the Proceedings of the Joint FEFG/lCF International Conference on Fracture of Engineering Materials and Structures held in Singapore from the 6th to 8th of August 1991, is a testimony of this multidisciplinary nature. This International Conference was the Second Symposium of the Far East Fracture Group (FEFG) and thus provided a unique opportunity for researchers and ...
The Chemistry of Cationic Polymerization
The Chemistry of Cationic Polymerization covers the fundamental aspects of organic chemistry that provide significant insights into the many facets of cationic polymerization processes and products. Each chapter deals with individual and groups of monomers. Considerable chapters examine the chemistry of oxygen compounds. Other chapters describe the techniques for cationic polymer analysis and detection. This text also considers sulfur compounds, particularly their polymerizations by radical and anionic mechanisms. The remaining chapters explore the polymerization and products of carbonium ions, related organic reactions and comparison with radical and anionic polymerizations, as well as the conspectus of kinetics and mechanism. This book is of great value to organic and polymer chemists.
