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Management Information And Optoelectronic Engineering - Proceedings Of The 2015 International Conference On Management, Information And Communication And The 2015 International Conference On Optics And Electronics Engineering
This book, Management Information and Optoelectronic Engineering, is a collection of papers presented at the 2015 International Conference on Management, Information and Communication and the 2015 International Conference on Optics and Electronics Engineering which was held on October 24-25, 2015 in Xia Men, China. The book provides state-of-the-art research results and development activities in Optics and Electronics Engineering, Management, Information and Communication and will benefit researchers and practitioners in the field.
Time Parallel Time Integration
Predicting the future is a difficult task but, as with the weather, it is possible with good models. But how does one predict the far future before the near future is known? Time parallel time integration, also known as PinT (Parallel-in-Time) methods, aims to predict the near and far future simultaneously. In this self-contained book, the first on the topic, readers will find a comprehensive and up-to-date description of methods and techniques that have been developed to do just this. The authors describe the four main classes of PinT methods: shooting-type methods, waveform relaxation methods, time parallel multigrid methods, and direct time parallel methods. In addition, they provide historical background for each of the method classes, complete convergence analyses for the most representative variants of the methods in each class, and illustrations and runnable MATLAB code. An ideal introduction to this exciting and very active research field, Time Parallel Time Integration can be used for independent study or for a graduate course.
Steady-State Methods for Simulating Analog and Microwave Circuits
The motivation for starting the work described in this book was the interest that Hewlett-Packard's microwave circuit designers had in simulation techniques that could tackle the problem of finding steady state solutions for nonlinear circuits, particularly circuits containing distributed elements such as transmission lines. Examining the problem of computing steady-state solutions in this context has led to a collection of novel numerical algorithms which we have gathered, along with some background material, into this book. Although we wished to appeal to as broad an audience as possible, to treat the subject in depth required maintaining a narrow focus. Our compromise was to assume that t...
The Bounding Approach to VLSI Circuit Simulation
This book proposes a new approach to circuit simulation that is still in its infancy. The reason for publishing this work as a monograph at this time is to quickly distribute these ideas to the research community for further study. The book is based on a doctoral dissertation undertaken at MIT between 1982 and 1985. In 1982 the author joined a research group that was applying bounding techniques to simple VLSI timing analysis models. The conviction that bounding analysis could also be successfully applied to sophisticated digital MOS circuit models led to the research presented here. Acknowledgments 'me author would like to acknowledge many helpful discussions and much support from his resea...
Design and Modeling for 3D ICs and Interposers
3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.
Interconnect Technology and Design for Gigascale Integration
This book is jointly authored by leading academic and industry researchers. The material is unique in that it spans IC interconnect topics ranging from IBM's revolutionary copper process to an in-depth exploration into interconnect-aware computer architectures.
Development, Validation, and Application of Semi-Analytical Interconnect Models for Efficient Simulation of Multilayer Substrates
This thesis deals with the development of semi-analytical models for the electrical behavior of vias and traces in chip packages and printed circuit boards. A framework for automated simulation of multilayer structures is also proposed. The validation and evaluation of the models are thoroughly addressed with several test structures and application studies. It is shown that the models can provide good results up to 40 GHz, whereas the numerical efficiency is at least two orders of magnitude higher in comparison to general-purpose numerical methods.
Continuous System Simulation
Highly computer-oriented text, introducing numerical methods and algorithms along with the applications and conceptual tools. Includes homework problems, suggestions for research projects, and open-ended questions at the end of each chapter. Written by our successful author who also wrote Continuous System Modeling, a best-selling Springer book first published in the 1991 (sold about 1500 copies).
Time-Domain Computer Analysis of Nonlinear Hybrid Systems
The analysis of nonlinear hybrid electromagnetic systems poses significant challenges that essentially demand reliable numerical methods. In recent years, research has shown that finite-difference time-domain (FDTD) cosimulation techniques hold great potential for future designs and analyses of electrical systems. Time-Domain Computer Analysis of Nonlinear Hybrid Systems summarizes and reviews more than 10 years of research in FDTD cosimulation. It first provides a basic overview of the electromagnetic theory, the link between field theory and circuit theory, transmission line theory, finite-difference approximation, and analog circuit simulation. The author then extends the basic theory of ...
Electrical Modeling and Design for 3D System Integration
New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package structures, integrated circuits, and printed circuit boards. Readers will discover the state of the technology in electronic package integration and printed circuit board simulation and modeling. In addition to popular full-wave electromagnetic computational methods, the book presents new, more sophis...
