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Intelligent Systems and Applications
This book presents the proceedings of the International Computer Symposium 2014 (ICS 2014), held at Tunghai University, Taichung, Taiwan in December. ICS is a biennial symposium founded in 1973 and offers a platform for researchers, educators and professionals to exchange their discoveries and practices, to share research experiences and to discuss potential new trends in the ICT industry. Topics covered in the ICS 2014 workshops include: algorithms and computation theory; artificial intelligence and fuzzy systems; computer architecture, embedded systems, SoC and VLSI/EDA; cryptography and information security; databases, data mining, big data and information retrieval; mobile computing, wireless communications and vehicular technologies; software engineering and programming languages; healthcare and bioinformatics, among others. There was also a workshop on information technology innovation, industrial application and the Internet of Things. ICS is one of Taiwan's most prestigious international IT symposiums, and this book will be of interest to all those involved in the world of information technology.
Advanced MEMS Packaging
A comprehensive guide to 3D MEMS packaging methods and solutions Written by experts in the field, Advanced MEMS Packaging serves as a valuable reference for those faced with the challenges created by the ever-increasing interest in MEMS devices and packaging. This authoritative guide presents cutting-edge MEMS (microelectromechanical systems) packaging techniques, such as low-temperature C2W and W2W bonding and 3D packaging. This definitive resource helps you select reliable, creative, high-performance, robust, and cost-effective packaging techniques for MEMS devices. The book will also aid in stimulating further research and development in electrical, optical, mechanical, and thermal design...
Republic of China
None
Advances in Mechanical Engineering
Selected, peer reviewed papers from the International Conference on Mechanical and Manufacturing Engineering (ICMME-2015), April 2-3, 2015, Kanchipuram, India
