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Advances in Heat Transfer
Advances in Heat Transfer
Thermal Conductivity
Fifty-one papers (and three keynote addresses) on contemporary theoretical issues and experimental techniques pertaining to the underlying factors that control heat-conduction behavior of materials. The latest findings on insulation, fluids, and low-dimensional solids and composites are reviewed as
Lunar Science
None
Thermal Conductivity 23
This book contains keynote lectures and 54 technical papers, presented at the 23rd International Thermal Conductivity Conference, on various topics, including techniques, coatings and films, theory, composites, fluids, metals, ceramics, and organics, related to thermal conductivity.
Spectroscopic Tricks
Spectroscopic Tricks was introduced in 1959 as a special section in the journal Applied Spectroscopy. Its purpose was to provide a means for communicating information on new devices, modifica tions of existing apparatuses, and other items of this nature of interest to the working spectroscopist. That it has proved valuable is indicated by the continuing publication of this section now under the title of Spectroscopic Techniques. However, the use fulness of these contributions, scattered through the many issues of the journal, diminishes as time passes since the reader must consult the annual indices of many volumes of the journal to find the contri bution that may hold the solution to his pr...
Dielectric Films for Advanced Microelectronics
The topic of thin films is an area of increasing importance in materials science, electrical engineering and applied solid state physics; with both research and industrial applications in microelectronics, computer manufacturing, and physical devices. Advanced, high-performance computers, high-definition TV, broadband imaging systems, flat-panel displays, robotic systems, and medical electronics and diagnostics are a few examples of the miniaturized device technologies that depend on the utilization of thin film materials. This book presents an in-depth overview of the novel developments made by the scientific leaders in the area of modern dielectric films for advanced microelectronic applications. It contains clear, concise explanations of material science of dielectric films and their problem for device operation, including high-k, low-k, medium-k dielectric films and also specific features and requirements for dielectric films used in the packaging technology. A broad range of related topics are covered, from physical principles to design, fabrication, characterization, and applications of novel dielectric films.
Microscale Heat Conduction in Integrated Circuits and Their Constituent Films
The study of thermal phenomena in microdevices has attracted significant attention recently. The interdisciplinary nature of this topic, however, makes it very difficult for researchers to fully understand details of research results presented in journal articles. For many researchers intending to be active in this field, therefore, a more comprehensive treatment, complete with sufficient background information, is urgently needed. Advances in semiconductor device technology render the thermal characterization and design of ICs increasingly more important. The present book discusses experimental and theoretical studies of heat transfer in transistors and interconnects. A novel optical thermo...
Curbside Consultation in Retina
Curbside Consultation in Retina: 49 Clinical Questions has been updated into a Second Edition! The Second Edition contains new questions and is completely updated! Curbside Consultation in Retina: 49 Clinical Questions, Second Edition contains new questions and brief, practical, and evidence-based answers to the most frequently asked questions that are posed during a “curbside consultation” between surgical colleagues. Dr. Sharon Fekrat, along with associate editors Drs. Akshay Thomas and Dilraj Grewal, have designed this unique reference that offers expert advice, preferences, and opinions on a variety of clinical questions commonly associated with the retina. The unique Q&A format prov...
