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Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has ...
This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.
Explores State-of-the-Art Work from the World's Foremost Scientists, Engineers, Educators, and Practitioners in the FieldWhy use smart materials?Since most smart materials do not add mass, engineers can endow structures with built-in responses to a myriad of contingencies. In their various forms, these materials can adapt to their environments by c
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With all the environmental concerns and constraints today and stricter future regulations, there is a patent need to replace materials noxious to the environment by environmentally-friendly alternatives. Electrically conductive adhesives (ECAs) are one such example. ECAs offer an excellent alternative to lead-solder interconnects for microelectroni
Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of miniaturized packages, providing low-loss electrical and/or optical communication, while protecting the semiconductor chips from environmental stresses and internal power cycling, require a carefully balanced selection of packaging materials and processes. Due to the relative fragility of these semiconductor chips, as well as the underlying laminated substrates and the bridging interconnect, selection of...
This book gathers a cross-disciplinary group of imminent scholars who have focussed their research on Tax in ASEAN and China and traverses a wide range of regional issues and jurisdictions.
When people make a call on a cellphone, drive a car, or turn on a computer, few truly appreciate the innovations in material selection, technology, and fabrication that were required to make it all possible. Innovations in Materials Manufacturing, Fabrication, and Environmental Safety explores expected developments in analysis, design, testing, and
For most of its modern history, to speak of Singapore was to speak of the Singapore River, physical centre of the city and site of the greater part of the colony's entrepot trade. The river has been transformed over the last 25 years from a polluted industrial sewer choked with traffic to a clean, placid waterway that forms the centrepiece of Singapore's financial, civic and entertainment districts. This transformation symbolizes the city-state's efforts to remake itself for the 21st century.Stephen Dobbs sets out the history of this waterway, and of the people who made it their home and workplace. He describes the tidal swamp in the early days of the British settlement, where merchants igno...
This book presents a collection of educational research and developmental efforts on the rapidly emerging use of infrared cameras and thermal imaging in science education. It provides an overview of infrared cameras in science education to date, and of the physics and technology of infrared imaging and thermography. It discusses different areas of application of infrared cameras in physics, chemistry and biology education, as well as empirical research on students’ interaction with the technology. It ends with conclusions drawn from the contributions as a whole and a formulation of forward-looking comments.