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Nowadays over 50% of integrated circuits are fabricated at wafer foundries. This book presents a foundry-integrated perspective of the field and is a comprehensive and up-to-date manual designed to serve process, device, layout, and design engineers. It comprises chapters carefully selected to cover topics relevant for them to deal with their work. The book provides an insight into the different types of design rules (DRs) and considerations for setting new DRs. It discusses isolation, gate patterning, S/D contacts, metal lines, MOL, air gaps, and so on. It explains in detail the layout rules needed to support advanced planarization processes, different types of dummies, and related utilitie...
Models offer benefits even before they are put on line. Based on years of experience, the authors reveal in New Directions in Bioprocess Modeling and Control that significant improvements can result from the process knowledge and insight that are gained when building experimental and first-principle models for process monitoring and control. Doing modeling in the process development and early commercialization phases is advantageous because it increases process efficiency and provides ongoing opportunities for improving process control. This technology is important for maximizing benefits from analyzers and control tool investments. If you are a process design, quality control, information s...
This volume contains the Proceedings of the International Conference on Simulation of Semiconductor Devices and Processes, SISPAD 01, held on September 5–7, 2001, in Athens. The conference provided an open forum for the presentation of the latest results and trends in process and device simulation. The trend towards shrinking device dimensions and increasing complexity in process technology demands the continuous development of advanced models describing basic physical phenomena involved. New simulation tools are developed to complete the hierarchy in the Technology Computer Aided Design simulation chain between microscopic and macroscopic approaches. The conference program featured 8 invited papers, 60 papers for oral presentation and 34 papers for poster presentation, selected from a total of 165 abstracts from 30 countries around the world. These papers disclose new and interesting concepts for simulating processes and devices.
The FAO/WHO Consultation on Health Implications of Acrylamide in Food has undertaken a preliminary evaluation of new and existing data and research on acrylamide. The consultation provided a range of recommendations for further information and new studies to better understand the risk to human health posed by acrylamide in food. The consultation also provided some advice to minimize whatever risk exists, including avoiding excessive cooking of food, choosing healthy eating, investigating possibilities for reducing levels of acrylamide in food and establishing an international network on acrylamide in food.
Power consumption is a key limitation in many high-speed and high-data-rate electronic systems today, ranging from mobile telecom to portable and desktop computing systems, especially when moving to nanometer technologies. Ultra Low-Power Electronics and Design offers to the reader the unique opportunity of accessing in an easy and integrated fashion a mix of tutorial material and advanced research results, contributed by leading scientists from academia and industry, covering the most hot and up-to-date issues in the field of the design of ultra low-power devices, systems and applications.
Protein Design: Methods and Applications presents the most up-to-date protein design and engineering strategies so that readers can undertake their own projects with a maximum chance of success. The authors present integrated computational approaches that require various degrees of computational complexity, and the major accomplishments that have been achieved in the design and structural characterization of helical peptides and proteins.
Since overall circuit performance has depended primarily on transistor properties, previous efforts to enhance circuit and system speed were focused on transistors as well. During the last decade, however, the parasitic resistance, capacitance, and inductance associated with interconnections began to influence circuit performance and will be the primary factors in the evolution of nanoscale ULSI technology. Because metallic conductivity and resistance to electromigration of bulk copper (Cu) are better than aluminum, use of copper and low-k materials is now prevalent in the international microelectronics industry. As the feature size of the Cu-lines forming interconnects is scaled, resistivit...
This book provides insight into the behavior and design of power distribution systems for high speed, high complexity integrated circuits. Also presented are criteria for estimating minimum required on-chip decoupling capacitance. Techniques and algorithms for computer-aided design of on-chip power distribution networks are also described; however, the emphasis is on developing circuit intuition and understanding the principles that govern the design and operation of power distribution systems.