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Electronic Packaging Materials and Their Properties
  • Language: en
  • Pages: 112

Electronic Packaging Materials and Their Properties

  • Type: Book
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  • Published: 2017-12-19
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  • Publisher: CRC Press

Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation. Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include: interconnections printed circuit boards substrates encapsulants dielectrics die attach materials electrical contacts thermal materials solders Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.

High Temperature Electronics
  • Language: en
  • Pages: 341

High Temperature Electronics

  • Type: Book
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  • Published: 2018-05-04
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  • Publisher: CRC Press

The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them. Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on...

Integrated Product and Process Design and Development
  • Language: en
  • Pages: 354

Integrated Product and Process Design and Development

  • Type: Book
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  • Published: 2009-07-28
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  • Publisher: CRC Press

Since the publication of the first edition of Integrated Product and Process Design and Development: The Product Realization Process more than a decade ago, the product realization process has undergone a number of significant changes. Reflecting these advances, this second edition presents a thorough treatment of the modern tools used in the integ

Product Design : Creativity, Concepts and Usability
  • Language: en
  • Pages: 317

Product Design : Creativity, Concepts and Usability

None

The City Record
  • Language: en
  • Pages: 258

The City Record

  • Type: Book
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  • Published: 1882
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  • Publisher: Unknown

None

Influence of Temperature on Microelectronics and System Reliability
  • Language: en
  • Pages: 332

Influence of Temperature on Microelectronics and System Reliability

  • Type: Book
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  • Published: 2020-07-09
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  • Publisher: CRC Press

This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substra...

Wideband Continuous-time ΣΔ ADCs, Automotive Electronics, and Power Management
  • Language: en
  • Pages: 352

Wideband Continuous-time ΣΔ ADCs, Automotive Electronics, and Power Management

  • Type: Book
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  • Published: 2016-08-12
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  • Publisher: Springer

This book is based on the 18 tutorials presented during the 25th workshop on Advances in Analog Circuit Design. Expert designers present readers with information about a variety of topics at the frontier of analog circuit design, including low-power and energy-efficient analog electronics, with specific contributions focusing on the design of continuous-time sigma-delta modulators, automotive electronics, and power management. This book serves as a valuable reference to the state-of-the-art, for anyone involved in analog circuit research and development.

Physics-of-Failure Based Handbook of Microelectronic Systems
  • Language: en
  • Pages: 271
Boston Directory
  • Language: en
  • Pages: 436

Boston Directory

  • Type: Book
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  • Published: 1851
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  • Publisher: Unknown

None

Advanced Manufacturing Systems, ICMSE 2011
  • Language: en
  • Pages: 3094

Advanced Manufacturing Systems, ICMSE 2011

This work brings together the latest applications of, and advances in, CAD/CAM/CAE, energy storage and energy development, mining machinery manufacturing, new energy equipment and manufacturing, cloud manufacturing and extreme manufacturing, bio-manufacturing, enterprise informationization, integrated manufacturing systems, quality monitoring and control of manufacturing processes, measurement control technologies and intelligent systems, embedded systems, etc. This broad overview of the latest advances also provides a reference source for researchers in this field.