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Rapid Thermal Processing
This is the first definitive book on rapid thermal processing (RTP), an essential namufacturing technology for single-wafer processing in highly controlled environments. Written and edited by nine experts in the field, this book covers a range of topics for academics and engineers alike, moving from basic theory to advanced technology for wafer manufacturing. The book also provides new information on the suitability or RTP for thin film deposition, junction formation, silicides, epitaxy, and in situ processing. Complete discussions on equipment designs and comparisons between RTP and other processing approaches also make this book useful for supplemental information on silicon processing, VLSI processing, and integrated circuit engineering.
Micromachining Techniques for Fabrication of Micro and Nano Structures
Micromachining is used to fabricate three-dimensional microstructures and it is the foundation of a technology called Micro-Electro-Mechanical-Systems (MEMS). Bulk micromachining and surface micromachining are two major categories (among others) in this field. This book presents advances in micromachining technology. For this, we have gathered review articles related to various techniques and methods of micro/nano fabrications, like focused ion beams, laser ablation, and several other specialized techniques, from esteemed researchers and scientists around the world. Each chapter gives a complete description of a specific micromachining method, design, associate analytical works, experimental set-up, and the final fabricated devices, followed by many references related to this field of research available in other literature. Due to the multidisciplinary nature of this technology, the collection of articles presented here can be used by scientists and researchers in the disciplines of engineering, materials sciences, physics, and chemistry.
Light Localisation and Lasing
This book presents research on quasi-random and random photonic systems for graduate students and researchers in optics, photonics and optical engineering.
Atomic Layer Deposition Applications 6
The continuously expanding realm of Atomic Layer Deposition (ALD) Applications is the focus of this reoccurring symposium. ALD can enable the precise deposition of ultra-thin, highly conformal coatings over complex 3D topographies with controlled thickness and composition. This issue of ECS Transactions contains peer reviewed papers presented at the symposium. A broad spectrum of ALD applications is featured, including novel nano-composites and nanostructures, dielectrics for state-of-the-art transistors and capacitors, optoelectronics, and a variety of other emerging applications.
Handbook of 3D Integration, Volume 1
The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.
Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators
A NATO Advanced Research Workshop (ARW) entitled “Advanced Materials and Technologies for Micro/Nano Devices, Sensors and Actuators” was held in St. Petersburg, Russia, from June 29 to July 2, 2009. The main goal of the Workshop was to examine (at a fundamental level) the very complex scientific issues that pertain to the use of micro- and nano-electromechanical systems (MEMS and NEMS), devices and technologies in next generation commercial and defen- related applications. Micro- and nano-electromechanical systems represent rather broad and diverse technological areas, such as optical systems (micromirrors, waveguides, optical sensors, integrated subsystems), life sciences and lab equipm...
Rapid Thermal and Other Short-time Processing Technologies II
"Electronics, Dielectric Science and Technology, and High Temperature Materials Divisions."
AmIware
Ambient Intelligence is one of the new paradigms in the development of information and communication technology, which has attracted much attention over the past years. The aim is the to integrate technology into people environment in such a way that it improves their daily lives in terms of well-being, creativity, and productivity. Ambient Intelligence is a multidisciplinary concept, which heavily builds on a number of fundamental breakthroughs that have been achieved in the development of new hardware concepts over the past years. New insights in nano and micro electronics, packaging and interconnection technology, large-area electronics, energy scavenging devices, wireless sensors, low power electronics and computing platforms enable the realization of the heaven of ambient intelligence by overcoming the hell of physics. Based on contributions from leading technical experts, this book presents a number of key topics on novel hardware developments, thus providing the reader a good insight into the physical basis of ambient intelligence. It also indicates key research challenges that must be addressed in the future.
