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Voids in Materials
Voids in Materials treats voids of different shapes and forms in various materials, and examines their effects on material properties. The book covers the origins of voids in materials, how they are sometimes introduced in the form of hollow spheres, and the resultant properties of materials containing voids. There are many books that focus on foams (which intentionally incorporate voids into materials) and that cover voids incidental to or unwanted in the fabrication of non-porous materials. In fact, all materials have voids. This book starts from the premise that voids are pervasive in all material on some level. It goes beyond foams to provide a comprehensive overview of voids, a central reference for scientists and engineers to use for the effect of voids in materials. - Includes 3D renderings of void geometries - Explains how and why voids are introduced into materials across the length scales; from nanometer-scale voids up to macro-scale voids - Provides a continuous picture of how material properties change as the volume fraction of voids increases, and the implications for product design
Congressional Record
The Congressional Record is the official record of the proceedings and debates of the United States Congress. It is published daily when Congress is in session. The Congressional Record began publication in 1873. Debates for sessions prior to 1873 are recorded in The Debates and Proceedings in the Congress of the United States (1789-1824), the Register of Debates in Congress (1824-1837), and the Congressional Globe (1833-1873)
Fracture of Nano and Engineering Materials and Structures
The 16th European Conference of Fracture (ECF16) was held in Greece, July, 2006. It focused on all aspects of structural integrity with the objective of improving the safety and performance of engineering structures, components, systems and their associated materials. Emphasis was given to the failure of nanostructured materials and nanostructures including micro- and nano-electromechanical systems (MEMS and NEMS).
