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New Challenges in Residual Stress Measurements and Evaluation
  • Language: en
  • Pages: 158

New Challenges in Residual Stress Measurements and Evaluation

Residual stresses (RS) are stresses present inside materials even in the absence of any applied load. They are of capital importance because they can impact greatly on the mechanical strength of the material, on its dimensional correspondence to design specifications as well as on the fatigue life of the part. RS measurement and evaluation is currently an important research topic where a lot of challenges still need to be addressed. This book aims to provide the reader with an overview of the principal novelties in this field including current limitations and potential future developments. Both radically new experimental approaches as well as recent evolutions of consolidated ones will be presented, along with the latest novelties in the area of numerical residual stress evaluation.

Sound Waves and Acoustic Emission
  • Language: en
  • Pages: 59

Sound Waves and Acoustic Emission

The nature of sound is, nowadays, well known and understood so that sound could be synthetically described like the propagation of vibration in elastic media.​Sound waves propagate as longitudinal waves, transverse waves, or in mixed modes in different media. The development of applications related to the proper management of the information connected with sound waves. This is the case of so-called acoustic emission. This book introduces the basics of sound waves, their types, propagation in different modes, velocities, and other properties It also introduces the basics of acoustic emission and the different sources of acoustic emission. This book delivers different propagation modes, their significance, and the attenuation and distortion of acoustic waves. One of the overlooked applications of acoustic emission, the acousto-ultrasonic approach is introduced and discussed with practical applications.

Advances in Design and Digital Communication IV
  • Language: en
  • Pages: 992

Advances in Design and Digital Communication IV

This book reports on research findings and practical lessons featuring advances in the areas of digital and interaction design, graphic design and branding, design education, society and communication in design practice, and related ones. Gathering the proceedings of the 7th International Conference on Digital Design and Communication, Digicom 2023, held on November 9-11, 2023, as a hybrid event, in/from Barcelos, Portugal, this book continues the tradition of the previous ones reporting on new design strategies to foster digital communication within and between the society, institutions and brands. By highlighting innovative ideas and reporting on multidisciplinary projects, it offers a source of inspiration for designers of all kinds, including graphic and web designers, UI, UX and social media designers, and to researchers, advertisers, artists, and brand and corporate communication managers alike.

Acoustic Emission and Durability of Composite Materials
  • Language: en
  • Pages: 212

Acoustic Emission and Durability of Composite Materials

In this book, two kinds of analysis based on acoustic emission recorded during mechanical tests are investigated. In the first, individual, analysis, acoustic signature of each damage mechanism is characterized. So with a clustering method, AE signals that have similar shapes or similar features can be group together into a cluster. Afterwards, each cluster can be linked with a main damage. The second analysis is based on a global AE analysis, on the investigation of liberated energy, with a view to identify a critical point. So beyond this characteristic point, the criticality can be modeled with a power-law in order to evaluate time to failure.

Advancement of Optical Methods & Digital Image Correlation in Experimental Mechanics, Volume 3
  • Language: en
  • Pages: 260

Advancement of Optical Methods & Digital Image Correlation in Experimental Mechanics, Volume 3

  • Type: Book
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  • Published: 2018-10-11
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  • Publisher: Springer

Advancement of Optical Methods & Digital Image Correlation in Experimental Mechanics, Volume 3 of the Proceedings of the 2018 SEM Annual Conference & Exposition on Experimental and Applied Mechanics, the third volume of eight from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on a wide range of optical methods ranging from traditional photoelasticity and interferometry to more recent DIC and DVC techniques, and includes papers in the following general technical research areas: New Developments in Optical Methods & Fringe Pattern Analysis; DIC Applications for Challenging Environments; Optical Methods in SEM: History & Perspective; Mechanical Characterization of Materials & Structures with Optical Methods; Bioengineering.

Mechanics of Composite, Hybrid and Multifunctional Materials, Volume 5
  • Language: en
  • Pages: 105

Mechanics of Composite, Hybrid and Multifunctional Materials, Volume 5

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Functional Materials for Bio-Applications
  • Language: en
  • Pages: 170

Functional Materials for Bio-Applications

This eBook is a collection of articles from a Frontiers Research Topic. Frontiers Research Topics are very popular trademarks of the Frontiers Journals Series: they are collections of at least ten articles, all centered on a particular subject. With their unique mix of varied contributions from Original Research to Review Articles, Frontiers Research Topics unify the most influential researchers, the latest key findings and historical advances in a hot research area! Find out more on how to host your own Frontiers Research Topic or contribute to one as an author by contacting the Frontiers Editorial Office: frontiersin.org/about/contact.

Application Specific Integrated Circuits
  • Language: en
  • Pages: 102

Application Specific Integrated Circuits

The field of application-specific integrated circuits (ASICs) is fast-paced being at the very forefront of modern nanoscale fabrication and presents a deeply engaging career path. ASICs can provide us with high-speed computation in the case of digital circuits. For example, central processing units, graphics processing units, field-programmable gate arrays, and custom-made digital signal processors are examples of ASICs and the transistors they are fabricated from. We can use that same technology complementary metal-oxide semiconductor processes to implement high-precision sensing of or interfacing to the world through analog-to-digital converters, digital-to-analog converters, custom image ...

I gruppi di ricerca sfide tecnologiche e sociali - Groups Research on kets and SCS
  • Language: it
  • Pages: 478

I gruppi di ricerca sfide tecnologiche e sociali - Groups Research on kets and SCS

In questo volume sono contenuti I contribute di 55 gruppi di ricerca: - DICATECH: 9 - DICAR: 12 - DMMM: 10 - DEI: 11 - DIF: 12 - I-D: 1 I “gruppi di ricerca” sono i veri protagonisti nel Politecnico di Bari sia dell’avanzamento disciplinare, sia dell’elaborazione di progetti al servizio del territorio (la cosiddetta terza missione), in genere in base al trasferimento tecnologico e del know-how. Essi incrociano l’avanzamento tecnologico (KETS) con le sfide sociali (SCS) KETs: nanotecnologie; materiali avanzati; sviluppo sostenibile; edifici ad alta efficienza energetica; le fabbriche del futuro; industrie di trasformazioni sostenibili. - SCs: salute, cambiamento demografico e beness...

Proceedings of the Third International Conference on Theoretical, Applied and Experimental Mechanics
  • Language: en
  • Pages: 345

Proceedings of the Third International Conference on Theoretical, Applied and Experimental Mechanics

This book presents the proceedings of the 3rd edition of the International Conference on Theoretical, Applied and Experimental Mechanics. The papers focus on all aspects of theoretical, applied and experimental mechanics, including biomechanics, composite materials, computational mechanics, constitutive modeling of materials, dynamics, elasticity, experimental mechanics, fracture mechanics, mechanical properties of materials, micromechanics, nanomechanics, plasticity, stress analysis, structures, wave propagation.