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There is arguably no field in greater need of a comprehensive handbook than computer engineering. The unparalleled rate of technological advancement, the explosion of computer applications, and the now-in-progress migration to a wireless world have made it difficult for engineers to keep up with all the developments in specialties outside their own. References published only a few years ago are now sorely out of date. The Computer Engineering Handbook changes all of that. Under the leadership of Vojin Oklobdzija and a stellar editorial board, some of the industry's foremost experts have joined forces to create what promises to be the definitive resource for computer design and engineering. Instead of focusing on basic, introductory material, it forms a comprehensive, state-of-the-art review of the field's most recent achievements, outstanding issues, and future directions. The world of computer engineering is vast and evolving so rapidly that what is cutting-edge today may be obsolete in a few months. While exploring the new developments, trends, and future directions of the field, The Computer Engineering Handbook captures what is fundamental and of lasting value.
These proceedings describe processing, materials, and equipment for CMOS front-end integration including gate stack, source/drain and channel engineering. Topics: strained Si/SiGe and Si/SiGe on insulator; high-mobility channels including III-V¿s, etc.; nanowires and carbon nanotubes; high-k dielectrics, metal and FUSI gate electrodes; doping/annealing for ultra-shallow junctions; low-resistivity contacts; advanced deposition (e.g. ALD, CVD, MBE), RTP, UV, plasma and laser-assisted processes.
This book provides an up-to-date review of the status and prospects of different options in energy conversion and storage technologies, as seen by a panel of world leading experts. It offers a platform for readers engaged in planning and undertaking new energy solutions, or retrofitting and redesigning the existing installations, to confront and to compare the pros and cons of various novel technology options. This book presents state-of-the-art papers on a timely topic.
This brief describes the basics of Riemannian optimization—optimization on Riemannian manifolds—introduces algorithms for Riemannian optimization problems, discusses the theoretical properties of these algorithms, and suggests possible applications of Riemannian optimization to problems in other fields. To provide the reader with a smooth introduction to Riemannian optimization, brief reviews of mathematical optimization in Euclidean spaces and Riemannian geometry are included. Riemannian optimization is then introduced by merging these concepts. In particular, the Euclidean and Riemannian conjugate gradient methods are discussed in detail. A brief review of recent developments in Riemannian optimization is also provided. Riemannian optimization methods are applicable to many problems in various fields. This brief discusses some important applications including the eigenvalue and singular value decompositions in numerical linear algebra, optimal model reduction in control engineering, and canonical correlation analysis in statistics.
ULSI Process Integration 6 covers all aspects of process integration. Sections are devoted to 1) Device Technologies, 2) Front-end-of-line integration (gate stacks, shallow junctions, dry etching, etc.), 3) Back-end-of-line integration (CMP, low-k, Cu interconnect, air-gaps, 3D packaging, etc.), 4) Alternative channel technologies (Ge, III-V, hybrid integration), and 5) Emerging technologies (CNT, graphene, polymer electronics, nanotubes).