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Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines
Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this book's microelectronic package design-for-reliability guidelines and approaches essential for achieving their life-cycle, cost-effectiveness, and on-time delivery goals. Its uniquely organized, time-phased approach to design, development, qualification, manufacture, and in-service management shows you step-by-step how to: Define realistic system requirements in terms of mission profile, operating life, performance expectations, size, weight, and cost Define the system usage environment so that all operating, shipping, and storage conditions, including electrical, thermal, radiation, an...
Power Hybrid Circuit Design & Manufacture
"Discusses the fundamental design principles, capabilities, and applications of power hybrid microcircuits and modules--detailing the operation of power semiconductor and passive components, the properties of materials, design guidelines, thermal management, and manufacturing technologies."
Invention of Integrated Circuits
This book is the first to give an authoritative and comprehensive account of the invention of Integrated Circuits (ICs) from an insider who had participated and contributed from the beginning of their invention and advancement to the Ultra Large Scale ICs (ULSICs) of today. It reads like a mystery novel to engross the reader, but it is not based on fiction; it gives documented facts of the invention of ICs, analyzes the patents, and highlights additional details and clarifications of their history.
Hybrid Circuit Design and Manufacture
This book provides a basic understanding of the design guidelines for a wide range of hybrid circuits, both thick and thin film, covering a wide range of frequencies. It is intended for electronic engineering designers and design managers who seek a background in hybrid technology.
Handbook of Thick- and Thin-Film Hybrid Microelectronics
This is the first handbook on the fabrication and design of hybrid microelectronic circuits. * Deals with all aspects of the technology, design, layout and processing of materials. * Fills the need for a comprehensive survey of a widely-used technology.
Integrated Circuit Packaging, Assembly and Interconnections
Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The book discusses the various packaging approaches, assembly options, and essential manufacturing technologies, among other relevant topics.
