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In this volume, Micromachining - New Trends and Applications, researchers from distant parts of the world have combined efforts and contributed their ideas and research work on micromachining. Their chapters will give you the opportunity to learn about materials, techniques, applications, challenges, and recent advancements in micromachining technology as well as about the state of the current micromachining market. Chapters also discuss concepts of micro-scale electronic component manufacturing, advancements in micromachining techniques of micro-electromechanical system (MEMS) piezoresistive pressure sensors to minimize offset drift due to humidity and temperature, the principles and classifications of force measuring systems with zero-compliance suspension, and triangular microcavity fabrication using micro-electrical discharge machining.
To present their work in the field of micromachining, researchers from distant parts of the world have joined their efforts and contributed their ideas according to their interest and engagement. Their articles will give you the opportunity to understand the concepts of micromachining of advanced materials. Surface texturing using pico- and femto-second laser micromachining is presented, as well as the silicon-based micromachining process for flexible electronics. You can learn about the CMOS compatible wet bulk micromachining process for MEMS applications and the physical process and plasma parameters in a radio frequency hybrid plasma system for thin-film production with ion assistance. Last but not least, study on the specific coefficient in the micromachining process and multiscale simulation of influence of surface defects on nanoindentation using quasi-continuum method provides us with an insight in modelling and the simulation of micromachining processes. The editors hope that this book will allow both professionals and readers not involved in the immediate field to understand and enjoy the topic.
Temperature is the most often-measured environmental quantity and scientists are continuously improving ways of sensing it. To present their work in the field of temperature sensing, researchers from distant parts of the world have joined their efforts and contributed their ideas according to their interest and engagement. Their articles will give you the opportunity to understand concepts and uses of fiber-optic sensing technology. The optical fiber Mach-Zehnder interferometer for temperature sensing is presented, as well as the optical fiber-distributed temperature sensor and fiber Bragg grating-based sensor. You can learn about tunable diode laser absorption spectroscopy and its various industrial applications. Last but not least, cutting temperature measurements during the machining of aluminum alloys provides us with an insight into the correlation between cutting conditions, mechanical strength of the aluminum alloy, and the cutting temperature measured using the tool-workpiece thermocouple system. The editors hope that the presented contributions will allow both professionals and readers not involved in the immediate field to understand and enjoy the topic.
Researchers from the entire world write to figure out their newest results and to contribute new ideas or ways in the field of system reliability and maintenance. Their articles are grouped into four sections: reliability, reliability of electronic devices, power system reliability and feasibility and maintenance. The book is a valuable tool for professors, students and professionals, with its presentation of issues that may be taken as examples applicable to practical situations. Some examples defining the contents can be highlighted: system reliability analysis based on goal-oriented methodology; reliability design of water-dispensing systems; reliability evaluation of drivetrains for off-...
MEMS technology is increasingly penetrating into our lives and improving our quality of life. In parallel to this, advances in nanotechnology and nanomaterials have been catalyzing the rise of NEMS. Consisting of nine chapters reviewing state-of-the-art technologies and their future trends, this book focuses on the latest development of devices and fabrication processes in the field of these extremely miniaturized electromechanical systems. The book offers new knowledge and insight into design, fabrication, and packaging, as well as solutions in these aspects for targeted applications, aiming to support scientists, engineers and academic trainees who are engaged in relevant research. In the chapters, practical issues and advances are discussed for flexible microdevices, bioMEMS, intelligent implants, optical MEMS, nanomachined structures and NEMS, and others. Most of the chapters also focus on novel fabrication/packaging processes, including silicon bulk micromachining, laser micromachining, nanolithography, and packaging for implantable microelectronics enabled by nanomaterials.
This book covers recent advancement methods used in analysing the root cause of engineering failures and the proactive suggestion for future failure prevention. The techniques used especially non-destructive testing such X-ray are well described. The failure analysis covers materials for metal and composites for various applications in mechanical, civil and electrical applications. The modes of failures that are well explained include fracture, fatigue, corrosion and high-temperature failure mechanisms. The administrative part of failures is also presented in the chapter of failure rate analysis. The book will bring you on a tour on how to apply mechanical, electrical and civil engineering fundamental concepts and to understand the prediction of root cause of failures. The topics explained comprehensively the reliable test that one should perform in order to investigate the cause of machines, component or material failures at the macroscopic and microscopic level. I hope the material is not too theoretical and you find the case study, the analysis will assist you in tackling your own failure investigation case.
This book is composed of different chapters which are related to the subject of injection molding and written by leading international academic experts in the field. It contains introduction on polymer PVT measurements and two main application areas of polymer PVT data in injection molding, optimization for injection molding process, Powder Injection Molding which comprises Ceramic Injection Molding and Metal Injection Molding, ans some special techniques or applications in injection molding. It provides some clear presentation of injection molding process and equipment to direct people in plastics manufacturing to solve problems and avoid costly errors. With useful, fundamental information for knowing and optimizing the injection molding operation, the readers could gain some working knowledge of the injection molding.
This book discusses key aspects of MEMS technology areas, organized in twenty-seven chapters that present the latest research developments in micro electronic and mechanical systems. The book addresses a wide range of fundamental and practical issues related to MEMS, advanced metal-oxide-semiconductor (MOS) and complementary MOS (CMOS) devices, SoC technology, integrated circuit testing and verification, and other important topics in the field. ?Several chapters cover state-of-the-art microfabrication techniques and materials as enabling technologies for the microsystems. Reliability issues concerning both electronic and mechanical aspects of these devices and systems are also addressed in various chapters.
The papers in this volume are a partial selection from the International Conference on Microelectronic 1999 which provides a forum for the presentation and discussion of the recent developments and future trends in the field of microelectronics."