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Guide to State-of-the-Art Electron Devices
Winner, 2013 PROSE Award, Engineering and Technology Concise, high quality and comparative overview of state-of-the-art electron device development, manufacturing technologies and applications Guide to State-of-the-Art Electron Devices marks the 60th anniversary of the IRE electron devices committee and the 35th anniversary of the IEEE Electron Devices Society, as such it defines the state-of-the-art of electron devices, as well as future directions across the entire field. Spans full range of electron device types such as photovoltaic devices, semiconductor manufacturing and VLSI technology and circuits, covered by IEEE Electron and Devices Society Contributed by internationally respected members of the electron devices community A timely desk reference with fully-integrated colour and a unique lay-out with sidebars to highlight the key terms Discusses the historical developments and speculates on future trends to give a more rounded picture of the topics covered A valuable resource R&D managers; engineers in the semiconductor industry; applied scientists; circuit designers; Masters students in power electronics; and members of the IEEE Electron Device Society.
Ultra-thin Chip Technology and Applications
Ultra-thin chips are the "smart skin" of a conventional silicon chip. This book shows how very thin and flexible chips can be fabricated and used in many new applications in microelectronics, Microsystems, biomedical and other fields. It provides a comprehensive reference to the fabrication technology, post processing, characterization and the applications of ultra-thin chips.
Hybrid Systems-in-Foil
Hybrid Systems-in-Foil (HySiF) is a concept that extends the potential of conventional More-than-More Systems-in/on-Package (SiPs and SoPs) to the flexible electronics world. In HySiF, an economical implementation of flexible electronic systems is possible by integrating a minimum number of embedded silicon chips and a maximum number of on-foil components. Here, the complementary characteristics of CMOS SoCs and larger area organic and printed electronics are combined in a HySiF-compatible polymeric substrate. Within the HySiF scope, the fabrication process steps and the integration design rules with all the accompanying boundary conditions concerning material compatibility, surface properties, and thermal budget, are defined. This Element serves as an introduction to the HySiF concept. A summary of recent ultra-thin chip fabrication and flexible packaging techniques is provided. Several bendable electronic components are presented demonstrating the benefits of HySiF. Finally, prototypes of flexible wireless sensor systems that adopt the HySiF concept are demonstrated.
Short-Channel Organic Thin-Film Transistors
This work takes advantage of high-resolution silicon stencil masks to build air-stable complementary OTFTs using a low-temperature fabrication process. Plastic electronics based on organic thin-film transistors (OTFTs) pave the way for cheap, flexible and large-area products. Over the past few years, OTFTs have undergone remarkable advances in terms of reliability, performance and scale of integration. Many factors contribute to the allure of this technology; the masks exhibit excellent stiffness and stability, thus allowing OTFTs with submicrometer channel lengths and superb device uniformity to be patterned. Furthermore, the OTFTs employ an ultra-thin gate dielectric that provides a sufficiently high capacitance to enable the transistors to operate at voltages as low as 3 V. The critical challenges in this development are the subtle mechanisms that govern the properties of aggressively scaled OTFTs. These mechanisms, dictated by device physics, are well described and implemented into circuit-design tools to ensure adequate simulation accuracy.
Embedded, Cyber-Physical, and IoT Systems
This Festschrift is in honor of Marilyn Wolf, on the occasion of her 60th birthday. Prof. Wolf is a renowned researcher and educator in Electrical and Computer Engineering, who has made pioneering contributions in all of the major areas in Embedded, Cyber-Physical, and Internet of Things (IoT) Systems. This book provides a timely collection of contributions that cover important topics related to Smart Cameras, Hardware/Software Co-Design, and Multimedia applications. Embedded systems are everywhere; cyber-physical systems enable monitoring and control of complex physical processes with computers; and IoT technology is of increasing relevance in major application areas, including factory auto...
Ferromagnetic Resonance
The book Ferromagnetic Resonance - Theory and Applications highlights recent advances at the interface between the science and technology of nanostructures (bilayer-multilayers, nanowires, spinel type nanoparticles, photonic crystal, etc.). The electromagnetic resonance techniques have become a central field of modern scientific and technical activity. The modern technical applications of ferromagnetic resonance are in spintronics, electronics, space navigation, remote-control equipment, radio engineering, electronic computers, maritime, electrical engineering, instrument-making and geophysical methods of prospecting.
Analog Circuit Design
This book contains the revised contributions of all the speakers of the fifth AACD Workshop which was held in Lausanne on April 2-4, 1996. It was organized by Dr Vlado Valence of the EPFL University and MEAD of Lausanne. The program consisted of six tutorials per day during three days. The tutorials were presented by experts in the field. They were selected by a program committee consisting of Prof. Willy Sansen of the Katholieke Universiteit Leuven, Prof. Rudy van de Plassche of Philips Research and the University of Technology Eindhoven and Prof. 10han Huijsing of the Delft University of Technology. The three topics mentioned above have been selected because of their importance in present ...
Silicon Heterostructure Handbook
An extraordinary combination of material science, manufacturing processes, and innovative thinking spurred the development of SiGe heterojunction devices that offer a wide array of functions, unprecedented levels of performance, and low manufacturing costs. While there are many books on specific aspects of Si heterostructures, the Silicon Heterostructure Handbook: Materials, Fabrication, Devices, Circuits, and Applications of SiGe and Si Strained-Layer Epitaxy is the first book to bring all aspects together in a single source. Featuring broad, comprehensive, and in-depth discussion, this handbook distills the current state of the field in areas ranging from materials to fabrication, devices,...
