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Mechanical Properties of Metallic Composites
Provides coverage of dispersion-hardened and fibre-reinforced alloys, addressing principal mechanisms, processing and applications. Mechanical behaviour based on dislocation theory and elastic-plastic mechanics is dealt with and data on advanced composites are provided.
Advanced Manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging
This issue of Soldering & Surface Mount Technology (SSMT) presents a number of papers from the 7th High Density Microsystems Design, Packaging and Failure Analysis (HDP'05) conference held in 2005 in the dynamic city of Shanghai, China. With over 100 high quality technical papers and presentation this annual conference brings together scholars and industrialists from Asia, Europe and the Americas to discuss the challenges and latest advances in high density packaging. This e-book contains six papers from the HDP conference, plus one additional contribution, which discuss the behaviour of key i.
Introduction to Microsystem Packaging Technology
The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—including design and manufacturing technologies—is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems. Introduction to Microsystem Packaging Technology details the latest advances in this vital area, which involves microelectronics, optoelectronics, RF and wireless, MEMS, and related packaging and assembling technologies. It is purposefully written so that each chapt...
Interfacial Science in Ceramic Joining
A unique combination of the basic science and fundamental aspects of joints and interfaces with the engineering aspects of the subject. Contributors include researchers drawn from several Eastern European countries. Topics addressed include processing, interfacial reactions, graded joints, residual stress measurement and analysis, and failure and deformation. Audience: Academic and industrial researchers and ceramic manufacturers interested in understanding the current state of the art in joining.
Additive Manufacturing of Structural Electronics
Additive manufacturing, also called rapid prototyping or 3D printing is a disruptive manufacturing technique with a significant impact in electronics. With 3D printing, bulk objects with circuitry are embedded in the volume of an element or conformally coated on the surface of existing parts, allowing design and manufacturing of smaller and lighter products with fast customisation. The book covers both materials selection and techniques. The scope also covers the research areas of additive manufacturing of passive and active components, sensors, energy storage, bioelectronics and more.
Ceramic Microstructures
This volume, titled Proceedings of the International Materials Symposium on Ce ramic Microstructures: Control at the Atomic Level summarizes the progress that has been achieved during the past decade in understanding and controlling microstructures in ceram ics. A particular emphasis of the symposium, and therefore of this volume, is advances in the characterization, understanding, and control of micro structures at the atomic or near-atomic level. This symposium is the fourth in a series of meetings, held every ten years, devoted to ceramic microstructures. The inaugural meeting took place in 1966, and focussed on the analysis, significance, and production of microstructure; the symposium e...
CMOSET 2012 Final Program
Final program for the CMOSET 2012 conference
