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Fuel Cell Electronics Packaging
  • Language: en
  • Pages: 254

Fuel Cell Electronics Packaging

Today's commercial, medical and military electronics are becoming smaller and smaller. At the same time these devices demand more power and currently this power requirement is met almost exclusively by battery power. This book includes coverage of ceramic hybrid separators for micro fuel cells and miniature fuel cells built with LTCC technology. It also covers novel fuel cells and discusses the application of fuel cell in microelectronics.

From Start-Up to Star
  • Language: en

From Start-Up to Star

  • Type: Book
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  • Published: 2014-12-05
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  • Publisher: Unknown

20 Win-Win Ways TO Satisfy YOUR Customers AND YOUR Margins From his humble childhood selling fish to passersby in China to accepting the 2013 Tibbetts Award at the White House for small business excellence, Ken Kuang's inspiring story and insightful tips will empower you to take your business to the next level. Inside, you'll learn how to: - Establish credibility - Anticipate customer needs - Turn challenges into opportunities - Build a winning team - Get more by asking for less No matter what industry you're in, From Start-Up to Star provides stimulating ideas, useful stratagems, and winning tactics for businesses of all sizes.

RF and Microwave Microelectronics Packaging
  • Language: en
  • Pages: 295

RF and Microwave Microelectronics Packaging

RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.

RF and Microwave Microelectronics Packaging II
  • Language: en
  • Pages: 172

RF and Microwave Microelectronics Packaging II

  • Type: Book
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  • Published: 2017-03-09
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  • Publisher: Springer

This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.

China
  • Language: en
  • Pages: 524

China

  • Type: Book
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  • Published: 1956
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  • Publisher: Unknown

None

Gazetteer - United States Board on Geographic Names
  • Language: en
  • Pages: 540

Gazetteer - United States Board on Geographic Names

  • Type: Book
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  • Published: 1956
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  • Publisher: Unknown

None

Conveyor Belt Furnace Thermal Processing
  • Language: en
  • Pages: 175

Conveyor Belt Furnace Thermal Processing

  • Type: Book
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  • Published: 2017-11-14
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  • Publisher: Springer

This practical book is tailored for engineers working in the industry, and condenses more than a decade’s worth of application experience on furnaces. The various topics discussed include conveyor furnaces, belt furnaces, solar cells, brazing furnaces, thick film furnaces, and furnace air flow and reflow. There are chapters on the influence of belt furnace and firing on silicon solar cells, thin film CIGS solar cells, dye-sensitized solar cells, crystalline solar cells, and lithium ion batteries, as well as how the processes affect the efficiency of each. The authors also address the influence of belt furnace on various processes such as metallization, engine valve heat treatment, brazing, post mold curing, and glass-to-metal sealing. The last few chapters also address Direct Bond Copper (DBC) technologies, and the effect of profile and atmosphere on the reflow process.

Advanced Thermal Management Materials
  • Language: en
  • Pages: 163

Advanced Thermal Management Materials

Advanced Thermal Management Materials provides a comprehensive and hands-on treatise on the importance of thermal packaging in high performance systems. These systems, ranging from active electronically-scanned radar arrays to web servers, require components that can dissipate heat efficiently. This requires materials capable of dissipating heat and maintaining compatibility with the packaging and dye. Coverage includes all aspects of thermal management materials, both traditional and non-traditional,with an emphasis on metal based materials. An in-depth discussion of properties and manufacturing processes, and current applications are provided. Also presented are a discussion of the importance of cost, performance and reliability issues when making implementation decisions, product life cycle developments, lessons learned and future directions.

The Encyclopedia of Eastern Philosophy and Religion
  • Language: en
  • Pages: 489

The Encyclopedia of Eastern Philosophy and Religion

With more than four thousand entries and over one hundred illustrations, this encyclopedia offers a complete survey of the four major religious traditions of Asia. It is designed not only for students and scholars but also to help general readers find their way through the thicket of unfamiliar words and concepts that are often encountered today in various fields such as the health professions, psychotherapy, the sciences, and the media. Among the subjects covered are: • Important terms such as chakra, karma, koan, nirvana, tantra, Tao, and yin-yang • The lives and teachings of mystics, philosophers, and masters of meditation • Basic texts and scriptures • Sects and schools of thought • Mythological figures and events In addition, pronunciation tables, a comprehensive bibliography, and a Ch'an/Zen Lineage Chart are provided.

Advanced Thermal Management Materials
  • Language: en
  • Pages: 163

Advanced Thermal Management Materials

Advanced Thermal Management Materials provides a comprehensive and hands-on treatise on the importance of thermal packaging in high performance systems. These systems, ranging from active electronically-scanned radar arrays to web servers, require components that can dissipate heat efficiently. This requires materials capable of dissipating heat and maintaining compatibility with the packaging and dye. Coverage includes all aspects of thermal management materials, both traditional and non-traditional,with an emphasis on metal based materials. An in-depth discussion of properties and manufacturing processes, and current applications are provided. Also presented are a discussion of the importance of cost, performance and reliability issues when making implementation decisions, product life cycle developments, lessons learned and future directions.