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These three volumes are intended to shape the field of nanoscience and technology and will serve as an essential point of reference for cutting-edge research in the field.
Increasing rice yields to keep pace with the growing population is the focus of this work. Factors controlling yield are discussed from the agronomic to the molecular level.
Vols. for 1963- include as pt. 2 of the Jan. issue: Medical subject headings.
An emerging technology or device architecture called 3-D IC integration is based on the system performance gains that can be achieved by stacking and vertically interconnecting distinct device chips. The 3-D concept of replacing long 2-D interconnects with shorter vertical (3-D) interconnects has the potential to alleviate the well-known interconnect (RC) delay problem facing the semiconductor industry. Additional benefits of the 3-D concept for the IC maker include reduced die size and the ability to use distinct technologies (analog, logic, RF, etc...) on separate vertically interconnected layers. The 3-D concept, therefore, allows the integration of otherwise incompatible technologies, and offers significant advantages in performance, functionality, and form factor. Topics in this book include: fabrication of 3-D ICs; modeling, simulation and scaling of 3-D integrated devices; applications of 3-D integration; through wafer interconnects for 3-D packaging and interposer applications; bonding technology for 3-D integration; and enabling processes for 3-D integration.