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Cumulated Index Medicus
  • Language: en
  • Pages: 1646

Cumulated Index Medicus

  • Type: Book
  • -
  • Published: 1998
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  • Publisher: Unknown

None

Oxford Handbook of Nanoscience and Technology
  • Language: en
  • Pages: 957

Oxford Handbook of Nanoscience and Technology

These three volumes are intended to shape the field of nanoscience and technology and will serve as an essential point of reference for cutting-edge research in the field.

Redesigning Rice Photosynthesis to Increase Yield
  • Language: en
  • Pages: 304

Redesigning Rice Photosynthesis to Increase Yield

Increasing rice yields to keep pace with the growing population is the focus of this work. Factors controlling yield are discussed from the agronomic to the molecular level.

Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding
  • Language: en
  • Pages: 636
Index Medicus
  • Language: en
  • Pages: 1810

Index Medicus

  • Type: Book
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  • Published: 2004
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  • Publisher: Unknown

Vols. for 1963- include as pt. 2 of the Jan. issue: Medical subject headings.

Enabling Technologies for 3-D Integration: Volume 970
  • Language: en
  • Pages: 320

Enabling Technologies for 3-D Integration: Volume 970

  • Type: Book
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  • Published: 2007-03-30
  • -
  • Publisher: Unknown

An emerging technology or device architecture called 3-D IC integration is based on the system performance gains that can be achieved by stacking and vertically interconnecting distinct device chips. The 3-D concept of replacing long 2-D interconnects with shorter vertical (3-D) interconnects has the potential to alleviate the well-known interconnect (RC) delay problem facing the semiconductor industry. Additional benefits of the 3-D concept for the IC maker include reduced die size and the ability to use distinct technologies (analog, logic, RF, etc...) on separate vertically interconnected layers. The 3-D concept, therefore, allows the integration of otherwise incompatible technologies, and offers significant advantages in performance, functionality, and form factor. Topics in this book include: fabrication of 3-D ICs; modeling, simulation and scaling of 3-D integrated devices; applications of 3-D integration; through wafer interconnects for 3-D packaging and interposer applications; bonding technology for 3-D integration; and enabling processes for 3-D integration.

Proceedings of the Second Symposium on Thin Film Transistor Technologies
  • Language: en
  • Pages: 428