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Low and High Dielectric Constant Materials
Contains papers from a May 2000 symposium, representing the state of the art in areas of dielectric materials science and process integration. Papers are arranged in sections on low and high dielectric constant materials, covering topics such as ammonia plasma passivation effects on properties of post-CMP low-k HSQ, characterization of ashing effects on low-k dielectric films, and electron beam curing of thin film polymer dielectrics. Other subjects include characterization of high-k dielectrics using the non-contact surface charge profiler method, and processing effects and electrical evaluation of ZrO2 formed by RTP oxidation of Zr. Loboda is affiliated with Dow Corning Corporation. c. Book News Inc.
Land Use and Watersheds
Presents recent data on how forest management activities and urbanization have influenced the hydrologic and geomorphic responses of watersheds. Focusing on the Pacific Northwest, the 12 contributions discuss wetland processes, channel disturbance, changes in hydrology, and susceptibility to landslides in cities, and consider the effects of timber harvesting and road construction on stream flow, sediment yield, and erosion. Field studies of paired experimental/manipulated watersheds, plot studies, and spatially distributed models are provided. No index. c. Book News Inc.
20th International Conference on Silicon Carbide and Related Materials (ICSCRM 2023)
Selected peer-reviewed extended articles based on abstracts presented at the 20th International Conference on Silicon Carbide and Related Materials (ICSCRM 2023) Aggregated Book
Maro Polymer Notes
None
Ceramic Abstracts
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