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Prognostics and Health Management of Electronics
  • Language: en
  • Pages: 805

Prognostics and Health Management of Electronics

An indispensable guide for engineers and data scientists in design, testing, operation, manufacturing, and maintenance A road map to the current challenges and available opportunities for the research and development of Prognostics and Health Management (PHM), this important work covers all areas of electronics and explains how to: assess methods for damage estimation of components and systems due to field loading conditions assess the cost and benefits of prognostic implementations develop novel methods for in situ monitoring of products and systems in actual life-cycle conditions enable condition-based (predictive) maintenance increase system availability through an extension of maintenanc...

Influence of Temperature on Microelectronics and System Reliability
  • Language: en
  • Pages: 332

Influence of Temperature on Microelectronics and System Reliability

  • Type: Book
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  • Published: 1997-04-24
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  • Publisher: CRC Press

This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substra...

Product Reliability, Maintainability, and Supportability Handbook, Second Edition
  • Language: en
  • Pages: 480

Product Reliability, Maintainability, and Supportability Handbook, Second Edition

  • Type: Book
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  • Published: 2009-04-16
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  • Publisher: CRC Press

To ensure product reliability, an organization must follow specific practices during the product development process that impact reliability. The second edition of the bestselling Product Reliability, Maintainability, and Supportability Handbook helps professionals identify the shortcomings in the reliability practices of their organizations and empowers them to take actions to overcome them. The book begins by discussing product effectiveness and its related functions, presents the mathematical theory for reliability, and introduces statistical inference concepts as ways to analyze probabilistic models from observational data. Later chapters introduce basic types of probability distribution...

Electronic Packaging Materials and Their Properties
  • Language: en
  • Pages: 128

Electronic Packaging Materials and Their Properties

  • Type: Book
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  • Published: 2017-12-19
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  • Publisher: CRC Press

Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation. Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include: interconnections printed circuit boards substrates encapsulants dielectrics die attach materials electrical contacts thermal materials solders Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.

Lead-free Electronics
  • Language: en
  • Pages: 794

Lead-free Electronics

Lead-free Electronics provides guidance on the design and use of lead-free electronics as well as technical and legislative perspectives. All the complex challenges confronting the elec-tronics industry are skillfully addressed: * Complying with state legislation * Implementing the transition to lead-free electronics, including anticipating associated costs and potential supply chain issues * Understanding intellectual property issues in lead-free alloys and their applications, including licensing and infringement * Implementing cost effective manufacturing and testing * Reducing risks due to tin whiskers * Finding lead-free solutions in harsh environments such as in the automotive and telec...

Electrical Connectors
  • Language: en
  • Pages: 384

Electrical Connectors

Discover the foundations and nuances of electrical connectors in this comprehensive and insightful resource Electrical Connectors: Design, Manufacture, Test, and Selection delivers a comprehensive discussion of electrical connectors, from the components and materials that comprise them to their classifications and underwater, power, and high-speed signal applications. Accomplished engineer and author Michael G. Pecht offers readers a thorough explanation of the key performance and reliability concerns and trade-offs involved in electrical connector selection. Readers, both at introductory and advanced levels, will discover the latest industry standards for performance, reliability, and safet...

Encapsulation Technologies for Electronic Applications
  • Language: en
  • Pages: 508

Encapsulation Technologies for Electronic Applications

Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated...

Copper Wire Bonding
  • Language: en
  • Pages: 235

Copper Wire Bonding

This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks. Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material. However, copper wire bonding has several process and reliability concerns due to its material properties. Copper Wire Bonding book lays out the challenges involved in replacing gold with copper as a wire bond material, and includes the bonding process changes—bond force, electric flame off, current and ultrasonic energy optimiz...

Guidebook for Managing Silicon Chip Reliability
  • Language: en
  • Pages: 205

Guidebook for Managing Silicon Chip Reliability

  • Type: Book
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  • Published: 2017-11-22
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  • Publisher: CRC Press

Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them. This quick reference on semiconductor reliability addresses the key question: How will the understanding of failure mechanisms affect the future? Chapters discuss: failure sites, operational loads, and failure mechanism intrinsic device sensitivities electromigration hot carrier aging time dependent dielectric breakdo...

Risk-Based Engineering
  • Language: en
  • Pages: 568

Risk-Based Engineering

  • Type: Book
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  • Published: 2018-04-19
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  • Publisher: Springer

The book comprehensively covers the various aspects of risk modeling and analysis in technological contexts. It pursues a systems approach to modeling risk and reliability concerns in engineering, and covers the key concepts of risk analysis and mathematical tools used to assess and account for risk in engineering problems. The relevance of incorporating risk-based structures in design and operations is also stressed, with special emphasis on the human factor and behavioral risks. The book uses the nuclear plant, an extremely complex and high-precision engineering environment, as an example to develop the concepts discussed. The core mechanical, electronic and physical aspects of such a comp...