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Ultra-Thin Sensors and Data Conversion Techniques for Hybrid System-in-Foil
This book reports on the design, fabrication and characterization of a set of flexible electronic components, including on-foil sensors, organic thin-film transistors and ultra-thin chips. The core of the work is on showing how to combine high-performance integrated circuits with large-area electronic components on a single polymeric foil, to realize smart electronic systems for different applications, such as temperature, humidity and mechanical stress sensors. The book offers an extensive introduction to Hybrid System-in-Foil technology (HySiF), and related on-chip/on-foil passive and active components. It presents six case studies designed to highlight key HySiF challenges, together with ...
Advances in Semiconductor Technologies
Advances in Semiconductor Technologies Discover the broad sweep of semiconductor technologies in this uniquely curated resource Semiconductor technologies and innovations have been the backbone of numerous different fields: electronics, online commerce, the information and communication industry, and the defense industry. For over fifty years, silicon technology and CMOS scaling have been the central focus and primary driver of innovation in the semiconductor industry. Traditional CMOS scaling has approached some fundamental limits, and as a result, the pace of scientific research and discovery for novel semiconductor technologies is increasing with a focus on novel materials, devices, desig...
Hybrid Systems-in-Foil
Hybrid Systems-in-Foil (HySiF) is a concept that extends the potential of conventional More-than-More Systems-in/on-Package (SiPs and SoPs) to the flexible electronics world. In HySiF, an economical implementation of flexible electronic systems is possible by integrating a minimum number of embedded silicon chips and a maximum number of on-foil components. Here, the complementary characteristics of CMOS SoCs and larger area organic and printed electronics are combined in a HySiF-compatible polymeric substrate. Within the HySiF scope, the fabrication process steps and the integration design rules with all the accompanying boundary conditions concerning material compatibility, surface properties, and thermal budget, are defined. This Element serves as an introduction to the HySiF concept. A summary of recent ultra-thin chip fabrication and flexible packaging techniques is provided. Several bendable electronic components are presented demonstrating the benefits of HySiF. Finally, prototypes of flexible wireless sensor systems that adopt the HySiF concept are demonstrated.
Stretchable Systems
Stretchable electronics is one of the transformative pillars of future flexible electronics. As a result, the research on new passive and active materials, novel designs, and engineering approaches has attracted significant interest. Recent studies have highlighted the importance of new approaches that enable the integration of high-performance materials, including, organic and inorganic compounds, carbon-based and layered materials, and composites to serve as conductors, semiconductors or insulators, with the ability to accommodate electronics on stretchable substrates. This Element presents a discussion about the strategies that have been developed for obtaining stretchable systems, with a focus on various stretchable geometries to achieve strain invariant electrical response, and summarises the recent advances in terms of material research, various integration techniques of high-performance electronics. In addition, some of the applications, challenges and opportunities associated with the development of stretchable electronics are discussed.
LCP for Microwave Packages and Modules
A comprehensive overview of electrical design using Liquid Crystal Polymer (LCP) at package, component and system levels, providing a detailed look at everything you need to know to get up-to-speed on the subject, including successful design details, techniques and potential pitfalls.
1D Semiconducting Nanostructures for Flexible and Large-Area Electronics
Semiconducting nanostructures such as nanowires (NWs) have been used as building blocks for various types of sensors, energy storage and generation devices, electronic devices and for new manufacturing methods involving printed NWs. The response of these sensing/energy/electronic components and the new fabrication methods depends very much on the quality of NWs and for this reason it is important to understand the growth mechanism of 1D semiconducting nanostructures. This is also important to understand the compatibility of NW growth steps and tools used in the process with these unconventional substrates such as plastic that are used in flexible and large area electronics. Therefore, this Element presents at length discussion about the growth mechanisms, growth conditions and the tools used for the synthesis of NWs. Although NWs from Si, ZnO and carbon nanotubes (CNTs) are included, the discussion is generic and relevant to several other types of NWs as well as heterostructures.
Integration Techniques for Micro/Nanostructure-based Large-Area Electronics
Advanced nanostructured materials such as organic and inorganic micro/nanostructures are excellent building blocks for electronics, optoelectronics, sensing, and photovoltaics because of their high-crystallinity, long aspect-ratio, high surface-to-volume ratio, and low dimensionality. However, their assembly over large areas and integration in functional circuits are a matter of intensive investigation. This Element provides detailed description of various technologies to realize micro/nanostructures based large-area electronics (LAE) devices on rigid or flexible/stretchable substrates. The first section of this Element provides an introduction to the state-of-the-art integration techniques used to fabricate LAE devices based on different kind of micro/nanostructures. The second section describes inorganic and organic micro/nanostructures, including most common and promising synthesis procedures. In the third section,different techniques are explained that have great potential for integration of micro/nanostructures over large areas. Finally, the fourth section summarizes important remarks about LAE devices based on micro/nanostructures, and future directions.
Organic and Amorphous-Metal-Oxide Flexible Analogue Electronics
Recent years have witnessed significant research efforts in flexible organic and amorphous-metal-oxide analogue electronics, in view of its formidable potential for applications such as smart sensor systems. This Element provides a comprehensive overview of this growing research area. After discussing the properties of organic and amorphous-metal-oxide technologies relevant to analogue circuits, this Element focuses on their application to two key circuit blocks: amplifiers and analogue-to-digital converters. The Element thus provides a fresh look at the evolution and immediate opportunities of the field, and identifies the remaining challenges for these technologies to become the platform of choice for flexible analogue electronics.
A Flexible Multi-Functional Touch Panel for Multi-Dimensional Sensing in Interactive Displays
Touch screen panels (TSPs) have become an integral part of modern-day lifestyle. To enhance user experience, attributes such as form-factor flexibility, multi-dimensional sensing, low power consumption and low cost have become highly desirable. This Element addresses the design of multi-functional TSPs with integrated concurrent capture of ubiquitous capacitive touch signals and force information. It compares and contrasts interactive technologies and presents design considerations for multi-dimensional touch screens with high detection sensitivity, accuracy and resolution.
