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Integrated Pest Management – Dissemination and Impact, Volume 2 is a sequel to Integrated Pest Management – Innovation-DevelopmentProcess, Volume 1. The book focuses on the IPM systems in the developed countries of North America, Europe and Australia, and the developing countries of Asia, Latin America and Africa. One of the major impedimentsin the dissemination and adoption of the IPM innovation is the complexity of the technology and reaching the vast population of farmers especially in the developing countries. The IPM-innovation development process is incomplete without the diffusion and adoption of IPM methods by the end users, and through its consequences. In spite of all the effor...
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The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
Peter Gunnarson Rambo (b. ca. 1611/12) was probably born in Stockholm, Sweden. He came to America in 1640 and settled in Christiana, New Sweden (now Delaware). He moved to Passyunk, Pennsylvania before 1669. Descendants and relatives lived in Pennsylvania, Delaware, Virginia, North Carolina, Ohio and later scattered throughout the United States.