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The 14th International Conference on Wear of Materials took place in Washington, DC, USA, 30 March - 3 April 2003. These proceedings contain over two-hundred peer reviewed papers containing the best research, technical developments and engineering case studies from around the world. Biomaterials and nano-tribology receive special attention in this collection reflecting the general trends in the field. Further highlights include a focus on the new generation of instrumentation to probe wear at increasingly small scales. Approximately ninety communications and case studies, a popular format for the academic community have also been included, enabling the inclusion of the most up-to-date research. Over 200 peer-reviewed papers including hot topics such as biomaterials and nano-tribology Keeping you up-to-date with the latest research from leading experts Includes communications and case studies
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Each May, the Continuing Education Division of the T.J.Watson School of Engineering, Applied Science and Technology at the State University of New York at Binghamton sponsors an Annual Symposium in Electronics Packaging in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (the University-Industry Partnership for Economic Growth.) Each volume of this Electronics Packaging Forum series is based on the the preceding Symposium, with Volume Two based on the 1990 presentations. The Preface to Volume One included a brief definition of the broad scope of the electronics packaging field with some comments on why it has recently assumed such a more prominent priority for research and development. Those remarks will not be repeated here; at this point it is assumed that the reader is a professional in the packaging field, or possibly a student of one of the many academic disciplines which contribute to it. It is worthwhile repeating the series objectives, however, so the reader will be clear as to what might be expected by way of content and level of each chapter.
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