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Influence of Temperature on Microelectronics and System Reliability
  • Language: en
  • Pages: 332

Influence of Temperature on Microelectronics and System Reliability

  • Type: Book
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  • Published: 2020-07-09
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  • Publisher: CRC Press

This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substra...

Handbook of Electronic Package Design
  • Language: en
  • Pages: 844

Handbook of Electronic Package Design

  • Type: Book
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  • Published: 2018-10-24
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  • Publisher: CRC Press

Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development

Prognostics and Health Management of Electronics
  • Language: en
  • Pages: 335

Prognostics and Health Management of Electronics

The first book on Prognostics and Health Management of Electronics Recently, the field of prognostics for electronic products has received increased attention due to the potential to provide early warning of system failures, forecast maintenance as needed, and reduce life cycle costs. In response to the subject's growing interest among industry, government, and academic professionals, this book provides a road map to the current challenges and opportunities for research and development in Prognostics and Health Management (PHM). The book begins with a review of PHM and the techniques being developed to enable a prognostics approach for electronic products and systems. building on this founda...

The Electrical Engineering Handbook,Second Edition
  • Language: en
  • Pages: 2758

The Electrical Engineering Handbook,Second Edition

  • Type: Book
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  • Published: 1997-09-26
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  • Publisher: CRC Press

In 1993, the first edition of The Electrical Engineering Handbook set a new standard for breadth and depth of coverage in an engineering reference work. Now, this classic has been substantially revised and updated to include the latest information on all the important topics in electrical engineering today. Every electrical engineer should have an opportunity to expand his expertise with this definitive guide. In a single volume, this handbook provides a complete reference to answer the questions encountered by practicing engineers in industry, government, or academia. This well-organized book is divided into 12 major sections that encompass the entire field of electrical engineering, includ...

The Electrical Engineering Handbook - Six Volume Set
  • Language: en
  • Pages: 3672

The Electrical Engineering Handbook - Six Volume Set

  • Type: Book
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  • Published: 2018-12-14
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  • Publisher: CRC Press

In two editions spanning more than a decade, The Electrical Engineering Handbook stands as the definitive reference to the multidisciplinary field of electrical engineering. Our knowledge continues to grow, and so does the Handbook. For the third edition, it has grown into a set of six books carefully focused on specialized areas or fields of study. Each one represents a concise yet definitive collection of key concepts, models, and equations in its respective domain, thoughtfully gathered for convenient access. Combined, they constitute the most comprehensive, authoritative resource available. Circuits, Signals, and Speech and Image Processing presents all of the basic information related t...

Circuits, Signals, and Speech and Image Processing
  • Language: en
  • Pages: 720

Circuits, Signals, and Speech and Image Processing

  • Type: Book
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  • Published: 2018-10-03
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  • Publisher: CRC Press

In two editions spanning more than a decade, The Electrical Engineering Handbook stands as the definitive reference to the multidisciplinary field of electrical engineering. Our knowledge continues to grow, and so does the Handbook. For the third edition, it has expanded into a set of six books carefully focused on a specialized area or field of study. Each book represents a concise yet definitive collection of key concepts, models, and equations in its respective domain, thoughtfully gathered for convenient access. Circuits, Signals, and Speech and Image Processing presents all of the basic information related to electric circuits and components, analysis of circuits, the use of the Laplace...

Nanopackaging
  • Language: en
  • Pages: 996

Nanopackaging

  • Type: Book
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  • Published: 2018-09-22
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  • Publisher: Springer

This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.

Reliability Technology
  • Language: en
  • Pages: 420

Reliability Technology

A unique book that describes the practical processes necessary to achieve failure free equipment performance, for quality and reliability engineers, design, manufacturing process and environmental test engineers. This book studies the essential requirements for successful product life cycle management. It identifies key contributors to failure in product life cycle management and particular emphasis is placed upon the importance of thorough Manufacturing Process Capability reviews for both in-house and outsourced manufacturing strategies. The readers? attention is also drawn to the many hazards to which a new product is exposed from the commencement of manufacture through to end of life disp...

Thermal Management of Electronic Systems II
  • Language: en
  • Pages: 358

Thermal Management of Electronic Systems II

For the second time, the Eurotherm Committee has chosen Thermal Managment of Electronic Systems as the subject for its 45th Seminar, held at IMEC in Leuven, Belgium, from 20 to 22 September 1995. After the successfui first edition of this seminar in Delft, June 14-16, 1993, it was decided to repeat this event on a two year basis. This volume constitutes the edited proceedings of the Seminar. Thermal management of electronic systems is gaining importance. Whereas a few years ago papers on this subject where mainly devoted to applications in high end markets, such as mainframes and telecommunication switching equipment, we see a growing importance in the "lower" end applications. This may be u...

The Safety Promise and Challenge of Automotive Electronics
  • Language: en
  • Pages: 226

The Safety Promise and Challenge of Automotive Electronics

"TRB has released the final version of TRB Special Report 308: The Safety Promise and Challenge of Automotive Electronics: Insights from Unintended Acceleration, which examines how the National Highway Traffic Safety Administration (NHTSA) regulatory, research, and defect investigation programs can be strengthened to meet the safety assurance and oversight challenges arising from the expanding functionality and use of automotive electronics. The report gives particular attention to the NHTSA response to consumer complaints of vehicles accelerating unintentionally and to concerns that faulty electronic systems may have been to blame. The committee that produced the report found that the incre...