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Recent developments in microelectronics technologies have created a great demand for interlayer dielectric materials with a very low dielectric constant. They will play a crucial role in the future generation of IC devices (VLSI/UISI and high speed IC packaging). Considerable efforts have been made to develop new low as well as high dielectric constant materials for applications in electronics industries. Besides achieving either low or high dielectric constants, other materials' properties such as good processability, high mechanical strength, high thermal and environmental stability, low thermal expansion, low current leakage, low moisture absorption, corrosion resistant, etc., are of equa...
Annotation Contains papers presented at the March 1999 symposium held in Seattle, Washington, with sections on standards, electrical insulating fluids, electrical tests, and fire issues. Specific topics include fire hazard testing in the International Electrotechnical Commission Standards, specification issues associated with the development of an agriculturally based biodegradable dielectric fluid, electrochemical stability of mineral insulating oils, standardized testing procedures and developments in partial discharge measurement, and comparative tracking index of flame-retardant nylon and PBT. The editor is affiliated with GBH International. Annotation copyrighted by Book News, Inc., Portland, OR.
In 1993, the first edition of The Electrical Engineering Handbook set a new standard for breadth and depth of coverage in an engineering reference work. Now, this classic has been substantially revised and updated to include the latest information on all the important topics in electrical engineering today. Every electrical engineer should have an opportunity to expand his expertise with this definitive guide. In a single volume, this handbook provides a complete reference to answer the questions encountered by practicing engineers in industry, government, or academia. This well-organized book is divided into 12 major sections that encompass the entire field of electrical engineering, includ...
The book provides comprehensive, up-to-date information on the physical properties of polymers including, viscoelasticity, flammability, miscibility, optical properties, surface properties and more. Containing carefully selected reprints from the Wiley's renowned Encyclopedia of Polymer Science and Technology, this reference features the same breadth and quality of coverage and clarity of presentation found in the original.
Filling the need for a single work specifically addressing how to use plasma for the fabrication of nanoscale structures, this book is the first to cover plasma deposition in sufficient depth. The author has worked with numerous R&D institutions around the world, and here he begins with an introductory overview of plasma processing at micro- and nanoscales, as well as the current problems and challenges, before going on to address surface preparation, generation and diagnostics, transport and the manipulation of nano units.
Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective. The last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems. - Consists of 16 self-contained chapters, contributed by a variety of active researchers from industrial, academic and governmental sectors - Addresses the need of materials scientists/engineers, electrical engineers, mechanical engineers, physicists and chemists to acquire a thorough knowledge of materials science - Explains how the materials for electronic packaging determine the overall effectiveness of electronic systems
Provides coverage on the full range of topics associated with polyimides, including structure, polymer fundamentals, and product areas. The text addresses both basic and applied aspects of the subject. It details the synthesis of polyimides, polyamideimides, and flourinated polyimides, explains the molecular design of photosensitive polyimides, and more.