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Electronic Materials Handbook
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of co...
Multichip Module Technologies and Alternatives: The Basics
Far from being the passive containers for semiconductor devices of the past, the packages in today's high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. While semiconductor circuit performance measured in picoseconds continues to improve, computer performance is expected to be in nanoseconds for the rest of this century -a factor of 1000 difference between on-chip and off-chip performance which is attributable to losses associated with the package. Thus the package, which interconnects all the chips to form a particular function such as a central processor, is likely to set the limits on how far computers can evolve. Multichip pac...
Proceedings
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Materials for Advanced Packaging
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Lead-Free Electronics
Based on the results of a more than two-year study, Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing is the first practical, primary reference to cover Pb-free solder assembly as well as the analysis and reasoning behind the selection of Sn-Ag-Cu as the recommended Pb-free replacement for Sn-Pb. Reflecting the results of a two-year study, Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing provides full coverage of the issues surrounding the implementation of Pb-free solder into electronic board assembly. This book is extremely timelyâ??most electronic manufacturers are going to change over to Pb free soldering by 2006 to meet new European laws. All manufacturers around the globe are going to be affected by this change. The text provides specific results from the thirty company NEMI project activities. It contains integrated and fully documented book chapters with references to existing published work in the area. These serve as tremendous resources for engineers and companies faced with making the switch to Pb-free solder assembly.
Electri-onics
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William J. Gedney’s Comparative Tai Source Book
This volume provides accurate and reliable data from 1,159 common cognates found in 19 dialects from the Tai language family. Originally collected by noted Tai linguist, the late William J. Gedney, the data are organized into the three branches of the Tai language family, the Southwestern, the Central, and the Northern, to facilitate comparisons among the various sound systems within the individual branches and within the Tai language family as a whole. Supplementing the cognates are phonological descriptions of each of the dialects. Included among the nineteen dialects are Siamese, White Tai, Black Tai, Shan, Lue, Yay, Saek, and dialects found at Leiping, Lungming, Pingsiang, and Ningming in China. The meticulous attention paid to consonants, vowels, and tones found in each cognate will allow for further dialect studies, for the investigation of questions concerning the tripartite division of the Tai language family, and for the continuing investigation into the reconstruction of the Proto-Tai language family and its wider genetic relationships.
