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ESD Testing
With the evolution of semiconductor technology and global diversification of the semiconductor business, testing of semiconductor devices to systems for electrostatic discharge (ESD) and electrical overstress (EOS) has increased in importance. ESD Testing: From Components to Systems updates the reader in the new tests, test models, and techniques in the characterization of semiconductor components for ESD, EOS, and latchup. Key features: Provides understanding and knowledge of ESD models and specifications including human body model (HBM), machine model (MM), charged device model (CDM), charged board model (CBM), cable discharge events (CDE), human metal model (HMM), IEC 61000-4-2 and IEC 61...
ESD
The scaling of semiconductor devices from sub-micron to nanometer dimensions is driving the need for understanding the design of electrostatic discharge (ESD) circuits, and the response of these integrated circuits (IC) to ESD phenomena. ESD Circuits and Devices provides a clear insight into the layout and design of circuitry for protection against electrical overstress (EOS) and ESD. With an emphasis on examples, this text: explains ESD buffering, ballasting, current distribution, design segmentation, feedback, coupling, and de-coupling ESD design methods; outlines the fundamental analytical models and experimental results for the ESD design of MOSFETs and diode semiconductor device element...
Microelectronics Failure Analysis
For newcomers cast into the waters to sink or swim as well as seasoned professionals who want authoritative guidance desk-side, this hefty volume updates the previous (1999) edition. It contains the work of expert contributors who rallied to the job in response to a committee's call for help (the committee was assigned to the update by the Electron
Models for Large Integrated Circuits
A modern microelectronic circuit can be compared to a large construction, a large city, on a very small area. A memory chip, a DRAM, may have up to 64 million bit locations on a surface of a few square centimeters. Each new generation of integrated circuit- generations are measured by factors of four in overall complexity -requires a substantial increase in density from the current technology, added precision, a decrease of the size of geometric features, and an increase in the total usable surface. The microelectronic industry has set the trend. Ultra large funds have been invested in the construction of new plants to produce the ultra large-scale circuits with utmost precision under the mo...
Mixed-Mode Simulation
Our purpose in writing this book was two-fold. First, we wanted to compile a chronology of the research in the field of mixed-mode simulation over the last ten to fifteen years. A substantial amount of work was done during this period of time but most of it was published in archival form in Masters theses and Ph. D. dissertations. Since the interest in mixed-mode simulation is growing, and a thorough review of the state-of-the-art in the area was not readily available, we thought it appropriate to publish the information in the form of a book. Secondly, we wanted to provide enough information to the reader so that a proto type mixed-mode simulator could be developed using the algorithms in t...
Principles of VLSI System Planning
This book describes a new type of computer aided VLSI design tool, called a VLSI System Planning, that is meant to aid designers dur ing the early, or conceptual, state of design. During this stage of design, the objective is to define a general design plan, or approach, that is likely to result in an efficient implementation satisfying the initial specifications, or to determine that the initial specifications are not realizable. A design plan is a collection of high level design decisions. As an example, the conceptual design of digital filters involves choosing the type of algorithm to implement (e. g. , finite impulse response or infinite impulse response), the type of polyno mial approx...
CMOS Logic Circuit Design
This is an up-to-date treatment of the analysis and design of CMOS integrated digital logic circuits. The self-contained book covers all of the important digital circuit design styles found in modern CMOS chips, emphasizing solving design problems using the various logic styles available in CMOS.
Devices for Integrated Circuits
This book develops the device physics of the Si and III-V compound semiconductor devices used in integrated circuits. Important equations are derived from basic physical concepts. The physics of these devices are related to the parameters used in SPICE. Terminology is intended to prepare students for reading technical journals on semiconductor devices. This text is suitable for first-year graduate students and seniors in Electrical Engineering; graduate students in Material Science and Chemical Engineering, interested in semiconductor materials; Computer Science students interested in custom VLSI design; and professionals in the semiconductor industry.
Mosfet Modeling for VLSI Simulation
A reprint of the classic text, this book popularized compact modeling of electronic and semiconductor devices and components for college and graduate-school classrooms, and manufacturing engineering, over a decade ago. The first comprehensive book on MOS transistor compact modeling, it was the most cited among similar books in the area and remains the most frequently cited today. The coverage is device-physics based and continues to be relevant to the latest advances in MOS transistor modeling. This is also the only book that discusses in detail how to measure device model parameters required for circuit simulations. The book deals with the MOS Field Effect Transistor (MOSFET) models that ar...
VLSI Design for Manufacturing: Yield Enhancement
One of the keys to success in the IC industry is getting a new product to market in a timely fashion and being able to produce that product with sufficient yield to be profitable. There are two ways to increase yield: by improving the control of the manufacturing process and by designing the process and the circuits in such a way as to minimize the effect of the inherent variations of the process on performance. The latter is typically referred to as "design for manufacture" or "statistical design". As device sizes continue to shrink, the effects of the inherent fluctuations in the IC fabrication process will have an even more obvious effect on circuit performance. And design for manufacture...
