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Issues in Disability, Rehabilitation, Wound Treatment, and Disease Management: 2011 Edition
Issues in Disability, Rehabilitation, Wound Treatment, and Disease Management: 2011 Edition is a ScholarlyEditions™ eBook that delivers timely, authoritative, and comprehensive information about Disability, Rehabilitation, Wound Treatment, and Disease Management. The editors have built Issues in Disability, Rehabilitation, Wound Treatment, and Disease Management: 2011 Edition on the vast information databases of ScholarlyNews.™ You can expect the information about Disability, Rehabilitation, Wound Treatment, and Disease Management in this eBook to be deeper than what you can access anywhere else, as well as consistently reliable, authoritative, informed, and relevant. The content of Issu...
Wafer Level 3-D ICs Process Technology
This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.
