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Anisotropic 2D Materials and Devices
Presenting recent progress in anisotropic 2D materials research, reader is introduced to phosphorene and its arsenic alloys, monochalcogenides of group IV elements in the form of MX (M = Ge, Sn and X = S, Se, Te), low-symmetry transition-metal dichalcogenide (TMD) materials such as rhenium disulphide (ReS2) and rhenium diselenide (ReSe2), and organic 2D materials. Providing detailed synthesis protocols and characterization techniques for these various anisotropic 2D materials, readers will learn their specific technological scopes for next generation electronics, optoelectronics and biomedical applications, challenges and future directions. Edited by an leading expert, contributors cover enh...
Nanonetworks
Learn the basics—and more—of nanoscale computation and communication in this emerging and interdisciplinary field The field of nanoscale computation and communications systems is a thriving and interdisciplinary research area which has made enormous strides in recent years. A working knowledge of nanonetworks, their conceptual foundations, and their applications is an essential tool for the next generation of scientists and network engineers. Nanonetworks: The Future of Communication and Computation offers a thorough, accessible overview of this subject rooted in extensive research and teaching experience. Offering a concise and intelligible introduction to the key paradigms of nanoscale...
Advanced Memory Technology
Advanced memory technologies are impacting the information era, representing a vibrant research area of huge interest in the electronics industry. The demand for data storage, computing performance and energy efficiency is increasing exponentially and will exceed the capabilities of current information technologies. Alternatives to traditional silicon technology and novel memory principles are expected to meet the need of modern data-intensive applications such as “big data” and artificial intelligence (AI). Functional materials or methodologies may find a key role in building novel, high speed and low power consumption computing and data storage systems. This book covers functional mate...
Low Power Semiconductor Devices and Processes for Emerging Applications in Communications, Computing, and Sensing
The book addresses the need to investigate new approaches to lower energy requirement in multiple application areas and serves as a guide into emerging circuit technologies. It explores revolutionary device concepts, sensors, and associated circuits and architectures that will greatly extend the practical engineering limits of energy-efficient computation. The book responds to the need to develop disruptive new system architectures and semiconductor processes aimed at achieving the highest level of computational energy efficiency for general purpose computing systems. Discusses unique technologies and material only available in specialized journal and conferences. Covers emerging materials and device structures, such as ultra-low power technologies, nanoelectronics, and microsystem manufacturing. Explores semiconductor processing and manufacturing, device design, and performance. Contains practical applications in the engineering field, as well as graduate studies. Written by international experts from both academia and industry.
Unbattled Fears: Reckoning the National Security
Strategic thinking has not been part of our national discourse. Till the end of 20th century, there were a very few public or private think tanks discussing the challenges our nation faced. There was no private news channel till 1999 and when they started, they went about doing their news business. Lack of strategic thinking was apparent during 1962 war with China, when we had clear indications of heinous moves and design of China. The Indian Army had submitted reports highlighting the Chinese threat but it all fell on deaf ears. The Prime Minister of the time thumped the table and said, “It is not the job of Commander-in-Chief to tell the Government who will attack India. China will never...
Non-layered 2D Materials
Semiconductors and Semimetals series, highlights new advances in the field, with this new volume presenting interesting chapters. Each chapter is written by an international board of authors. The existence of this book is a testament to the dedication and expertise of our esteemed authors and contributors from across the globe, all of whom are at the forefront of this rapidly evolving field Serves as your gateway to a comprehensive exploration of non-layered 2D materials Not only teaches you something new but also sparks your creativity and curiosity
Energy Harvesting with Functional Materials and Microsystems
For decades, people have searched for ways to harvest energy from natural sources. Lately, a desire to address the issue of global warming and climate change has popularized solar or photovoltaic technology, while piezoelectric technology is being developed to power handheld devices without batteries, and thermoelectric technology is being explored to convert wasted heat, such as in automobile engine combustion, into electricity. Featuring contributions from international researchers in both academics and industry, Energy Harvesting with Functional Materials and Microsystems explains the growing field of energy harvesting from a materials and device perspective, with resulting technologies c...
ETCMOS 2017 Final Program
Final program from the ETCMOS 2017 conference, May 28-30, 2017, in Warsaw, Poland.
3D Integration in VLSI Circuits
Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technol...
