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China has become a magnet for international business. At the same time, the "China boom" has also produced a dramatic increase in the number and complexity of business disputes. Knowing how to effectively manage business disputes is an important component of every successful China business strategy. Business Disputes in China, written by the world’s leading China disputes experts, provides you with an overview of current dispute settlement techniques and tools.
International Arbitration Institutions have led the way in rulemaking for international commercial arbitration. The institutional rules and commentary compiled in this easy-to-use reference tool are those promulgated by the institutions most often named in international agreements. The institutional rules and commentary compiled in this easy-to-use reference are those promulgated by the institutions most often named in international agreements. Arbitration Rules: International Institutions is the only resource to compile such an extensive array of commentary and analysis, written by leading arbitration authorities along with the full text of each set of rules.
International Commercial Arbitration in Hong Kong: A Guide provides an essential introduction to commercial arbitration law and practices, focusing on Hong Kong as an example of a model law jurisdiction with a pro-arbitration stance. With the evolution and increasing popularity of dispute resolution in the international arena, one is no longer able to rely purely on knowledge of the local law and practices. This timely book is written in simple English and clearly arranged in a step-by-step format. Newcomers to this legal field will find the principles covered in the book easy to understand. It begins with an overview of the various “Alternative Dispute Resolution” choices available in H...
The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
Electronics, communication and networks coexist, and it is not possible to conceive of our current society without them. Within the next decade we will probably see the consolidation of 6G-based technology, accompanied by many compatible devices, and fiber-optic is already an advanced technology with many applications. This book presents the proceedings of CECNet 2022, the 12th International Conference on Electronics, Communications and Networks, held as a virtual event with no face-to-face participation in Xiamen, China, from 4 to 7 November 2022. CECNet is held annually, and covers many interrelated groups of topics such as electronics technology, communication engineering and technology, ...
The quality of legislation within the Commonwealth is an essential element of democracy and the rule of law. Although a neglected territory until recently, the legislative drafting debate is at the forefront of academic and professional fora at a Commonwealth and at a national level. This book brings to light the academic foundations of legislative quality and the many recent innovations deriving from Commonwealth jurisdictions. This book was based on a special issue of the Commonwealth Law Bulletin.