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Electronic Packaging Materials and Their Properties
Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation. Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include: interconnections printed circuit boards substrates encapsulants dielectrics die attach materials electrical contacts thermal materials solders Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.
Wireless Sensor Networks for Healthcare Applications
This unique reference focuses on methods of application, validation and testing based on real deployments of sensor networks in the clinical and home environments. Key topics include healthcare and wireless sensors, sensor network applications, designs of experiments using sensors, data collection and decision making, clinical deployment of wireless sensor networks, contextual awareness medication prompting field trials in homes, social health monitoring, and the future of wireless sensor networks in healthcare.
Telemedicine for Trauma, Emergencies, and Disaster Management
Telemedicine has evolved to become an important field of medicine and healthcare, involving everything from simple patient care to actual performance of operations at a distance. This groundbreaking volume addresses the complex technical and clinical development in the management of trauma, disaster, and emergency situations using telemedicine. The book explains how telemedicine and related technologies can be used to effectively handle a wide range of scenarios, from a situation as small as a car crash, to major disasters such as an earthquake. Professionals find critical discussions on the practicality, logistics, and safety of telemedicine from recognized experts in the field. From teleteaching and telemonitoring, to teletrauma and telesurgery, this authoritative book covers all the major aspects that practitioners need to understand in order to engage and utilize this burgeoning area of medicine.
Electronic Packaging Materials and Their Properties
Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation. Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include: interconnections printed circuit boards substrates encapsulants dielectrics die attach materials electrical contacts thermal materials solders Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.
Book of Abstracts
None
Intel Corporation Patent Landscape Analysis – January 1, 1994 to December 31, 2013
The following analysis illustrates the underlying trends and relationships of U.S. issued patents of the subject company. The analysis employs two frequently used patent classification methods: US Patent Classification (UPC) and International Patent Classification (IPC). Aside from assisting patent examiners in determining the field of search for newly submitted patent applications, the two classification methods play a pivotal role in the characterization and analysis of technologies contained in collections of patent data. The analysis also includes the company’s most prolific inventors, top cited patents as well as foreign filings by technology area.
