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This book provides a comprehensive introduction to processing-in-memory (PIM) technology, from its architectures to circuits implementations on multiple memory types and describes how it can be a viable computer architecture in the era of AI and big data. The authors summarize the challenges of AI hardware systems, processing-in-memory (PIM) constraints and approaches to derive system-level requirements for a practical and feasible PIM solution. The presentation focuses on feasible PIM solutions that can be implemented and used in real systems, including architectures, circuits, and implementation cases for each major memory type (SRAM, DRAM, and ReRAM).
This reference text covers a wide spectrum for designing robust embedded memory and peripheral circuitry. It will serve as a useful text for senior undergraduate and graduate students and professionals in areas including electronics and communications engineering, electrical engineering, mechanical engineering, and aerospace engineering. Discusses low-power design methodologies for static random-access memory (SRAM) Covers radiation-hardened SRAM design for aerospace applications Focuses on various reliability issues that are faced by submicron technologies Exhibits more stable memory topologies Nanoscale technologies unveiled significant challenges to the design of energy- efficient and rel...
This book offers a balanced and comprehensive guide to the core principles, fundamental properties, experimental approaches, and state-of-the-art applications of two major groups of emerging non-volatile memory technologies, i.e. spintronics-based devices as well as resistive switching devices, also known as Resistive Random Access Memory (RRAM). The first section presents different types of spintronic-based devices, i.e. magnetic tunnel junction (MTJ), domain wall, and skyrmion memory devices. This section describes how their developments have led to various promising applications, such as microwave oscillators, detectors, magnetic logic, and neuromorphic engineered systems. In the second half of the book, the underlying device physics supported by different experimental observations and modelling of RRAM devices are presented with memory array level implementation. An insight into RRAM desired properties as synaptic element in neuromorphic computing platforms from material and algorithms viewpoint is also discussed with specific example in automatic sound classification framework.
After an overview of major scientific discoveries of the 18th and 19th centuries, which created electrical science as we know and understand it and led to its useful applications in energy conversion, transmission, manufacturing industry and communications, this Circuits and Systems History book fills a gap in published literature by providing a record of the many outstanding scientists, mathematicians and engineers who laid the foundations of Circuit Theory and Filter Design from the mid-20th Century. Additionally, the book records the history of the IEEE Circuits and Systems Society from its origins as the small Circuit Theory Group of the Institute of Radio Engineers (IRE), which merged w...
The objective of writing this book has been to provide research scholars with the most thorough and understandable presentation of the pipelined reconfigurable N-point FFT processor. This book is written specifically to meet the need of the research scholars in the area of digital filters design, DSP application, Hardware Implementation of FFT Algorithms and other related disciplines.
Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
This book describes methods to address wearout/aging degradations in electronic chips and systems, caused by several physical mechanisms at the device level. The authors introduce a novel technique called accelerated active self-healing, which fixes wearout issues by enabling accelerated recovery. Coverage includes recovery theory, experimental results, implementations and applications, across multiple nodes ranging from planar, FD-SOI to FinFET, based on both foundry provided models and predictive models. Presents novel techniques, tested with experiments on real hardware; Discusses circuit and system level wearout recovery implementations, many of these designs are portable and friendly to the standard design flow; Provides circuit-architecture-system infrastructures that enable the accelerated self-healing for future resilient systems; Discusses wearout issues at both transistor and interconnect level, providing solutions that apply to both; Includes coverage of resilient aspects of emerging applications such as IoT.
The wide gap between the existing security solutions and the actual practical deployment in smart manufacturing, smart home, and remote environments (with respect to wireless robotics) is one of the major reasons why we require novel strategies, mechanisms, architectures, and frameworks. Furthermore, it is also important to access and understand the different level of vulnerabilities and attack vectors in Wireless Sensor Network (WSN) and Wireless Robotics. This book includes an in-depth explanation of a secure and dependable Wireless Robotics (WR) architecture, to ensure confidentiality, authenticity, and availability. Features Blockchain technology for securing data at end/server side Emer...
The incessant scaling of complementary metal-oxide semiconductor (CMOS) technology has resulted in significant performance improvements in very-large-scale integration (VLSI) design techniques and system architectures. This trend is expected to continue in the future, but this requires breakthroughs in the design of nano-CMOS and post-CMOS technologies. Nanoelectronics refers to the possible future technologies beyond conventional CMOS scaling limits. This volume addresses the current state-of-the-art nanoelectronic technologies and presents potential options for next-generation integrated circuits. Nanoelectronics for Next-generation Integrated Circuits is a useful reference guide for researchers, engineers, and advanced students working on the frontier of the design and modeling of nanoelectronic devices and their integration aspects with future CMOS circuits. This comprehensive volume eloquently presents the design methodologies for spintronics memories, quantum-dot cellular automata, and post-CMOS FETs, including applications in emerging integrated circuit technologies.
This book describes the physical operation of the Tunnel Field-effect Transistor (TFET) and circuits built with this device. Whereas the majority of publications on TFETs describe in detail the device, its characteristics, variants and performance, this will be the first book addressing TFET integrated circuits (TFET ICs). The authors describe the peculiarities of TFET ICs and their differences with MOSFETs. They also develop and analyze a number of logic circuits and memories. The discussion also includes complex circuits combining CMOS and TFET, as well as a potential fabrication process in Silicon.