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Modeling of Adhesively Bonded Joints
A lot of recent developments have been made about adhesively bonded joints modeling using various methods of analysis. The increasing application of adhesives in industry is partly due to the increased sophistication and reliability of adhesive joints modeling. The book proposed intends to provide the designer with the most advanced stress analyses techniques in adhesive joints to reinforce the use of this promising bonding technique.
Reliability, Stress Analysis, and Failure Prevention Aspects of Adhesive and Bolted Joints, Rubber Components, Composite Springs
Comprises 15 contributions from the 1998 International Mechanical Engineering Congress and Exposition. Representative paper topics include performance prediction of elastomeric gasket materials by compression stress relaxation; the damping characteristics of machine structures assembled by bonding; stress analysis of bolted circular flanged joints with tap bolts; and proper selection of auxiliary heat source for reducing thermal residual stresses during the welding process. No subject index. Annotation copyrighted by Book News, Inc., Portland, OR
Reliability, Stress Analysis, and Failure Prevention Issues in Adhesively Bonded and Bolted Joints, Composites Design
Addresses some of the problems with the concentration of stress that are arising with the increased use of adhesives to hold products together, particularly but not exclusively those made of composite materials. Some bolted joints are also considered. Among the 16 topics are the three-level optimiza
Applied Stress Analysis
This volume records the proceedings of an international conference organised as a tribute to the contribution made by Professor H. Fessler over the whole of his pro fessionallife, in the field of applied stress analysis. The conference, held at the Univer sity of Nottingham on 30 and 31 August 1990, was timed to coincide with the date of his formal retirement from the post of Professor of Experimental Stress Analysis in the University. The idea grew from discussions between some of Professor Fessler's academic associates from Nottingham and elsewhere. An organising committee was set up, and it was decided to invite contributions to the conference in the form of review papers and original research papers in the field of experimental, theoretical and computational stress analysis. The size of the response, both in papers submitted and in attendance at the conference, indicates that the idea proved attractive to many of his peers, former associates and research students. A bound copy of the volume is to be presented to Professor Fessler at the conference dinner on 30 August 1990.
Analysis of Bolted Joints, 2000
Contains 18 papers presented at technical sessions on the analysis of bolted joints held during the July 2000 ASME conference. The major areas of discussion are gasket characteristics, metal-to-metal contact flanges, improved design and method, and finite element analysis. Topics include flow behavi
Reliability, Stress Analysis, and Failure Prevention Issues in Adhesive and Bolted Connections
Contains the 16 papers presented at the November 1999 symposium. The topics include temperature distribution in a VLSI chip due to dynamic power density, the strength of joints combining adhesives with bolts, optimization of adhesively bonded single lap joints by adhered notching, and estimation of
