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Upwind and High-Resolution Schemes
  • Language: en
  • Pages: 587

Upwind and High-Resolution Schemes

One of the major achievements in computational fluid dynamics has been the development of numerical methods for simulating compressible flows, combining higher-order accuracy in smooth regions with a sharp, oscillation-free representation of embedded shocks methods and now known as "high-resolution schemes". Together with introductions from the editors written from the modern vantage point this volume collects in one place many of the most significant papers in the development of high-resolution schemes as occured at ICASE.

Sensor Systems Simulations
  • Language: en
  • Pages: 457

Sensor Systems Simulations

  • Type: Book
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  • Published: 2019-06-18
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  • Publisher: Springer

This book describes for readers various technical outcomes from the EU-project IoSense. The authors discuss sensor integration, including LEDs, dust sensors, LIDAR for automotive driving and 8 more, demonstrating their use in simulations for the design and fabrication of sensor systems. Readers will benefit from the coverage of topics such as sensor technologies for both discrete and integrated innovative sensor devices, suitable for high volume production, electrical, mechanical, security and software resources for integration of sensor system components into IoT systems and IoT-enabling systems, and IoT sensor system reliability. Describes from component to system level simulation, how to ...

3D Microelectronic Packaging
  • Language: en
  • Pages: 629

3D Microelectronic Packaging

This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.

Technical Note - National Advisory Committee for Aeronautics
  • Language: en
  • Pages: 462
2024 the 8th International Conference on Energy and Environmental Science (ICEES 2024)
  • Language: en
  • Pages: 1052
Helicobacter pylori
  • Language: en
  • Pages: 515

Helicobacter pylori

The explosion of new information on Helicobacter pylori-related disease, both in the basic sciences and in clinical medicine, has continued to progress at an unprecedented pace. In many instances H. pylori infection, both in man and in the laboratory animal, has become a model to investigate fundamental biological issues such as micro-organism-host interactions, intracellular signalling, development of mucosal atrophy, mechanism of microbial resistance, disease modifying factors etc. In view of this bewildering flood of new information, the time was considered right to organize yet another update on H. pylori in the successful series 'Basic mechanisms to clinical cure' to define the 'state-o...

Tryptophan in Animal Nutrition and Human Health
  • Language: en
  • Pages: 220

Tryptophan in Animal Nutrition and Human Health

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Encyclopedia of Packaging Materials, Processes, and Mechanics
  • Language: en
  • Pages: 1079

Encyclopedia of Packaging Materials, Processes, and Mechanics

"Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of miniaturized packages, providing low-loss electrical and/or optical communication, while protecting the semiconductor chips from environmental stresses and internal power cycling, require a carefully balanced selection of packaging materials and processes. Due to the relative fragility of these semiconductor chips, as well as the underlying laminated substrates and the bridging interconnect, selection o...

Reliability of Organic Compounds in Microelectronics and Optoelectronics
  • Language: en
  • Pages: 552

Reliability of Organic Compounds in Microelectronics and Optoelectronics

This book aims to provide a comprehensive reference into the critical subject of failure and degradation in organic materials, used in optoelectronics and microelectronics systems and devices. Readers in different industrial sectors, including microelectronics, automotive, lighting, oil/gas, and petrochemical will benefit from this book. Several case studies and examples are discussed, which readers will find useful to assess and mitigate similar failure cases. More importantly, this book presents methodologies and useful approaches in analyzing a failure and in relating a failure to the reliability of materials and systems.

Horizons in World Physics
  • Language: en
  • Pages: 340

Horizons in World Physics

This volume presents leading-edge research in physics from researchers around the world. Contents: Preface; Interface-Localised Mode in Bilayer Film Ferromagnetic Resonance Spectrum; On Similarity Waves in Compacting Media; Generalised Relativistic Dynamics of Charged Particle; Deviatoric Elasticity as a Mechanism describing Stable Shapes of Nanotubes; A Thermodynamic Approach for Predicting Micelle and Asphaltene-Micelle Formation; Asymptotic Theories for the Non-linear Analysis of Axisymmetric Laminated Cylindrical Shells; Statistical Dynamics of Energy Transfer in Direct Inelastic Gas-Surface Scattering within Dynamical Lie Algebraic Method; Topologically Charged Vortex in a Supersymmetric Kalb-Ramond Theory; The Effect of Fibre Curvature on Suspension Viscosity; Measurements of Reaction Cross-Sections and Determination of Nucleon Matter Density Distributions; Index.