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This volume in the "Advances in Electrochemical Sciences and Engineering" series focuses on problem-solving, illustrating how to translate basic science into engineering solutions. The book's concept is to bring together engineering solutions across the range of nano-bio-photo-micro applications, with each chapter co-authored by an academic and an industrial expert whose collaboration led to reusable methods that are relevant beyond their initial use. Examples of experimental and/or computational methods are used throughout to facilitate the task of moving atomistic-scale discoveries and understanding toward well-engineered products and processes based on electrochemical phenomena.
Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers th
Like its predecessors, volume three of this meanwhile well-established series covers selected topics from electrochemical science and its applications. The authors have been carefully selected among the leaders in the respective fields. Their authoritative and comprehensive contributions represent the latest state-of-the-art. Special attention is paid to recent developments, which are critically and thoroughly discussed. Each contribution of the present volume continues the high standards of this series. This new series has been warmly welcomed by scientists world-wide, which is reflected by the following review of the second volume: 'All the contributions in this volume are well up to the standard of this excellent series and will be of great value to electrochemists... The editors again deserve to be congratulated on this fine collection of reviews.' Journal of Electroanalytical Chemistry and Interfacial Chemistry