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Clear your bookcase of references containing bits and pieces of useful information and replace them with this thorough, single-volume guide to thermal analysis. Air Cooling Technology for Electronic Equipment is a helpful, practical resource that answers questions frequently asked by thermal and packaging engineers grappling with today's demand for increased thermal control in electronics. Superbly organized for quick reference, the book dedicates each chapter to answering fundamental questions, such as: What is the optimal spacing between the printed circuit boards? What is a good estimate of the heat transfer coefficient and the associate pressure drop for forced convection over package ar...
The continuing trend toward miniaturization and high power density electronics results in a growing interdependency between different fields of engineering. In particular, thermal management has become essential to the design and manufacturing of most electronic systems.Heat Transfer: Thermal Management of Electronics details how engineers can use
The Eurotherm Committee has chosen Thermal Management of Electronic Systems as the subject of its 29th Seminar, at Delft University of Technology, the Netherlands, 14-16 June 1993. This volume constitutes the proceedings of the Seminar. Thermal Management is but one of the several critical topics in the design of electronic systems. However, as a result of the combined effects of increasing heat fluxes, miniaturisation and the striving for zero defects, preferably in less time and at a lower cost than before, thermal management has become an increasingly tough challenge. Therefore, it is being increasingly recognised that cooling requirements could eventually hamper the technical progress in...
Far from being the passive containers for semiconductor devices of the past, the packages in today's high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. While semiconductor circuit performance measured in picoseconds continues to improve, computer performance is expected to be in nanoseconds for the rest of this century -a factor of 1000 difference between on-chip and off-chip performance which is attributable to losses associated with the package. Thus the package, which interconnects all the chips to form a particular function such as a central processor, is likely to set the limits on how far computers can evolve. Multichip pac...
An intriguing local history looks at the rise to prominence of the Communist Party in a corner of Montana during the 1910s and 20s, including the Farmer Labor Party, as well as its fall due corruption by a few party members and intense scrutiny by the FBI. Original.
Advanced Packaging serves the semiconductor packaging, assembly and test industry. Strategically focused on emerging and leading-edge methods for manufacturing and use of advanced packages.
Originally developed for mechanical and aeronautical engineering, structural optimization is not so easily applied to civil and architectural engineering, as structures in these fields are not mass products, but more often unique structures planned in accordance with specific design requirements. The shape and geometry of such structures are determ
This book discusses the practical aspects of electrical and thermal modeling of packages. In addition, processing concerns for plastic packaged GaAs parts are also covered. The book emphasizes low cost industry standard packages. However, the principles involved translate well to other categories of packages. Digital issues such as crosstalk are well documented in other books and are therefore not covered in detail in this text. The principles for generation of equivalent circuit package models applies to both digital and analog parts. Digital designers and packaging engineers should still find this text useful. Subtleties often overlooked by standard methods of modeling packages for digital...
Moth-Flame Optimization algorithm is an emerging meta-heuristic and has been widely used in both science and industry. Solving optimization problem using this algorithm requires addressing a number of challenges, including multiple objectives, constraints, binary decision variables, large-scale search space, dynamic objective function, and noisy parameters. Handbook of Moth-Flame Optimization Algorithm: Variants, Hybrids, Improvements, and Applications provides an in-depth analysis of this algorithm and the existing methods in the literature to cope with such challenges. Key Features: Reviews the literature of the Moth-Flame Optimization algorithm Provides an in-depth analysis of equations, ...