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Proceedings of the NATO Advanced Research Workshop, Moscow, Russia, 2-7 August, 1999
The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects is the work of the European network ELFNET which was founded by the European Commission in the 6th Framework Programme. It brings together contributions from the leading European experts in lead-free soldering. The limited validity of testing methods originating from tin-lead solder was a major point of concern in ELFNET members' discussions. As a result, the network's reliability group decided to bring together the material properties of lead-free solders, as well as the basics of material science, and to discuss their influence on the procedures for accelerated testing. This has led to a matrix of failure mechanisms and their activation and, as a result, to a comprehensive coverage of the scientific background and its applications in reliability testing of lead-free solder joints. The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects is written for scientists, engineers and researchers involved with lead-free electronics.
This book is a result of contributions of experts from international scientific community working in different aspects of shape memory alloys (SMAs) and reports on the state-of-the-art research and development findings on this topic through original and innovative research studies. Through its five chapters, the reader will have access to works related to ferromagnetic SMAs, while it introduces some specific applications like development of faster SMA actuators and application of nanostructural SMAs in medical devices. The book contains up-to-date publications of leading experts, and the edition is intended to furnish valuable recent information to the professionals involved in shape memory alloys analysis and applications. The text is addressed not only to researchers but also to professional engineers, students, and other experts in a variety of disciplines, both academic and industrial, seeking to gain a better understanding of what has been done in the field recently and what kind of open problems are in this area.
Proceedings of the International Symposium held to coincide with the retirement of Professor John Humphreys in Manchester, UK, 5th – 7th September 2006
Selected, peer reviewed papers from the 8th European Conference on Residual Stresses, ECRS8, Riva del Garda, Italy 26-28 June 2010
Includes entries for maps and atlases.
The seventh European Conference on Residual Stresses (ECRS7), was held in Berlin, Germany, on the 13-15th September 2006. These rapidly published proceedings contain the oral and poster contributions which were presented at the conference. They have been grouped into topic areas covering: measurement techniques, generation of residual stresses by manufacturing, processing of materials, modelling and computation of residual stresses, residual stresses in thin layers, residual stresses in multiphase materials , micro and intergranular residual stresses, andesidual stresses and phase transformation.
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Incremental Sheet Forming (ISF) exempts use of dies and reduces cost for manufacturing complex parts. Sheet metal forming is used for producing high-quality components in automotive, aerospace, and medical industries. This book covers the benefits of this new technology, including the process parameters along with various techniques. Each variant of this novel process is discussed along with the requirements of machinery and hardware. In addition, appropriate guidelines are also suggested regarding the relationship between process parameters and aspects of ISF process in order to ensure the applicability of the process on the industrial scale. This book will be a useful asset for researchers, engineers in manufacturing industries, and postgraduate level courses.