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Electromigration in Metals
Learn to assess electromigration reliability and design more resilient chips in this comprehensive and practical resource. Beginning with fundamental physics and building to advanced methodologies, this book enables the reader to develop highly reliable on-chip wiring stacks and power grids. Through a detailed review on the role of microstructure, interfaces and processing on electromigration reliability, as well as characterisation, testing and analysis, the book follows the development of on-chip interconnects from microscale to nanoscale. Practical modeling methodologies for statistical analysis, from simple 1D approximation to complex 3D description, can be used for step-by-step development of reliable on-chip wiring stacks and industrial-grade power/ground grids. This is an ideal resource for materials scientists and reliability and chip design engineers.
Diseases of Fruits and Vegetables
Among the Horticultural Crops, Fruits and Vegetables (FV) are of primary - portance as the key source of essential components in an adequate and balanced human diet. FV have supported largely the daily food requirement of mankind since ages and even before man learned to grow cereal crops systematically. Over the years, growing FV has been the mainstay of rural economy and has emerged as an indispensable part of agriculture world over, offering farmers a wide range of crops in varied topography and climate. In certain parts of the world, FV are the major dietary staple. Apart from being a rich source of vitamins and minerals, this sector also contributes significantly in economy of the regio...
More-than-Moore Devices and Integration for Semiconductors
This book provides readers with a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems with a broad range of functionalities that can be added to 3D microsystems, including flexible electronics, metasurfaces and power sources. The book also includes examples of applications for brain-computer interfaces and event-driven imaging systems. Provides a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems; Covers functionalities to add to 3D microsystems, including flexible electronics, metasurfaces and power sources; Includes current applications, such as brain-computer interfaces, event - driven imaging and edge computing.
Metallization of Polymers 2
As the demands put on the polymer/metal interface, particularly by the microelectronics industry, become more and more severe, the necessity for understanding this interface, its properties and its limitations, becomes more and more essential. This requires a broad knowledge of, and a familiarity with, the latest findings in this rapidly advancing field. At the very least, such familiarity requires an exchange of infonnation, particularly among those intimately involved in this field. Communications among many of us in this area have made one fact quite obvious: the facilities provided by existing organizations, scientific and otherwise, do not offer the forum necessary to accomplish this ex...
Advanced Interconnects for ULSI Technology
Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects,...
Ceramic Technology and Processing
Perfect for the new technician or engineer entering the ceramics industry as well as for the ""old hand"" who needs an update on some aspect of ceramics processing, this resource provides practical laboratory-oriented answers to such typical processing problems as particle segregation, agglomeration, contamination, pressure gradients, adherence to tooling, and temperature gradients during drying and firing. The author examines the difficulties of practical testing and processing in the ceramic laboratory, such as vast differences in scale and equipment, and shows how to evaluate results taking such variables into account. Once the laboratory work is satisfactorily completed, the rest of the ...
Handbook of Thin Film Deposition Processes and Techniques
New second edition of the popular book on deposition (first edition by Klaus Schruegraf) for engineers, technicians, and plant personnel in the semiconductor and related industries. This book traces the technology behind the spectacular growth in the silicon semiconductor industry and the continued trend in miniaturization over the last 20 years. This growth has been fueled in large part by improved thin film deposition techniques and the development of highly specialized equipment to enable this deposition. The book includes much cutting-edge material. Entirely new chapters on contamination and contamination control describe the basics and the issues—as feature sizes shrink to sub-micron ...
