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Nanopackaging
  • Language: en
  • Pages: 553

Nanopackaging

This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.

Grammaticalization and Language Change in Chinese
  • Language: en
  • Pages: 335

Grammaticalization and Language Change in Chinese

  • Type: Book
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  • Published: 2004-08-02
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  • Publisher: Routledge

Grammaticalization and Language Change in Chinese illuminates how studies of language development and change provide special insights into the understanding of current, synchronic systems of language.

My Forty Years as a Diplomat
  • Language: en
  • Pages: 278

My Forty Years as a Diplomat

None

Goodbye, Your Majesty
  • Language: en
  • Pages: 1074

Goodbye, Your Majesty

  • Type: Book
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  • Published: 2019-12-06
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  • Publisher: Funstory

Three years together, her whole being lost in the mists of love he had given her, how could she have known it was a lie, and the stakes were the most important thing in her life.Sister-in-law, forsaken, a year of suffering, wear out all her thoughts."She had been reborn with a sense of hatred, and her state of mind had long since changed. She slowly pushed away the fog, yet she was caught up in a huge conspiracy."

Electrically Conductive Adhesives
  • Language: en
  • Pages: 434

Electrically Conductive Adhesives

  • Type: Book
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  • Published: 2008-12-23
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  • Publisher: BRILL

This book is based on two Special Issues of the Journal of Adhesion Science and Technology (JAST vol. 22, no. 8-9 and vol. 22, no. 14) dedicated to the logic of electrically conductive adhesives. The contains a total of 21 papers (reflecting overviews and original research).

Directory of Chinese University Graduates and Students in America
  • Language: en
  • Pages: 164

Directory of Chinese University Graduates and Students in America

  • Type: Book
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  • Published: 1946
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  • Publisher: Unknown

None

The Complete Dramatic Works of Tang Xianzu
  • Language: en
  • Pages: 1067

The Complete Dramatic Works of Tang Xianzu

Tang Xianzu is acclaimed as the ‘Shakespeare of the East’ and widely regarded as China’s greatest playwright. This is the first time the dramatist’s complete collected works have been translated into English and made available outside of China.

Polymers in Organic Electronics
  • Language: en
  • Pages: 617

Polymers in Organic Electronics

  • Type: Book
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  • Published: 2020-04-01
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  • Publisher: Elsevier

Polymers in Organic Electronics: Polymer Selection for Electronic, Mechatronic, and Optoelectronic Systems provides readers with vital data, guidelines, and techniques for optimally designing organic electronic systems using novel polymers. The book classifies polymer families, types, complexes, composites, nanocomposites, compounds, and small molecules while also providing an introduction to the fundamental principles of polymers and electronics. Features information on concepts and optimized types of electronics and a classification system of electronic polymers, including piezoelectric and pyroelectric, optoelectronic, mechatronic, organic electronic complexes, and more. The book is desig...

FFIT 2022
  • Language: en
  • Pages: 639

FFIT 2022

The 2022 International Conference on Financial Innovation, FinTech and Information Technology (FFIT 2022), hosted by Shenzhen University of Technology and organized by the Financial Innovation and Fintech Research Center of Shenzhen University of Technology, was held on October 28-30, 2022 in Shenzhen, China. Due to the current COVID-19 pandemic and the strict travelling rules, it is still difficult to take international travel for all our attendees to participate in the conference. Therefore, FFIT 2022 was held as a hybrid event. FFIT 2022 brought together innovative academics and industrial experts in the field of Financial Innovation, Financial Technology and Information Technology to discuss the latest research results in this field.

FFIT 2023
  • Language: en
  • Pages: 260

FFIT 2023

This book contains the proceedings of the 2nd International Conference on Financial Innovation, FinTech and Information Technology (FFIT 2023) held in Chongqing, China from July 7th to 9th, 2023. FFIT 2023 focuses on Economic statistics under big data, Financial risk control, Economic Modeling and Software Engineering, Accounting and Financial Information Systems, Innovative Supply Chain Financial Services and other fields. The aim of the conference is to provide a platform for experts, scholars, engineers, technicians and technical R&D personnel to share scientific research achievements and cutting-edge technologies, understand academic development trends, expand research ideas, strengthen academic research and discussion, and promote the industrialization cooperation of academic achievements. We hope that this conference will continue to be held in the coming years, making it an ideal platform for people to share views and experiences in financial innovation and economic development and related areas. We would also like to thank the invited speakers for their valuable contributions and for sharing their perspectives during their speeches.