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University Administration and System in India
Given that the economic development, accelerated by the expanding base of higher education may lead to the reduction of other kinds of disparities—social, regional, political—its contribution in stabilizing our civil society at this juncture of volatility cannot be underestimated which in turn may help the process of speedy national development further. The book raises all such issues. The insight of ‘university administration and systems in India’ is considered the most common issue for all the stakeholders engaged in higher education especially at post-graduate level and the readers have to wonder for authentic source of literature to understand the same. This predicament of intere...
Creating Knowledge, Strengthening Nations
"Creating Knowledge, Strengthening Nations" is a crucial addition to the debate on the future of higher education.
Heat Transfer Enhancement in Plate and Fin Extended Surfaces
This Brief deals with heat transfer and friction in plate and fin extended heat transfer enhancement surfaces. It examines Offset-Strip Fin (OSF), Enhancement Principle, Analytically Based Models for j and f vs. Re, Transition from Laminar to Turbulent Region, Correlations for j and f vs. Re, Use of OSF with Liquids, Effect of Percent Fin Offset, Effect of Burred Edges, Louver fin, heat transfer and friction correlations, flow structure in the louver fin array, analytical model for heat transfer and friction, convex louver fin, wavy fin, 3D corrugated fin, perforated fin, pin fins and wire mesh, types of vortex generators, metal foam fin, plain fin, packings, numerical simulation of various types of fins.
Prajñā
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Liquid-Vapor Phase-Change Phenomena
Since the second edition of Liquid-Vapor Phase-Change Phenomena was written, research has substantially enhanced the understanding of the effects of nanostructured surfaces, effects of microchannel and nanochannel geometries, and effects of extreme wetting on liquid-vapor phase-change processes. To cover advances in these areas, the new third edition includes significant new coverage of microchannels and nanostructures, and numerous other updates. More worked examples and numerous new problems have been added, and a complete solution manual and electronic figures for classroom projection will be available for qualified adopting professors.
3D Microelectronic Packaging
This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.
Nanomaterials
Many potential questions regarding the risks associated with the development and use of wide-ranging technologies enabled through engineered nanomaterials. For example, with over 600 consumer products available globally, what information exists that describes their risk to human health and the environment? What en- neering or use controls can be deployed to minimize the potential environmental health and safety impacts of nanomaterials throughout the manufacturing and product lifecycles? How can the potential environmental and health benefits of nanotechnology be realized and maximized? The idea for this book was conceived at the NATO Advanced Research Workshop (ARW) on “Nanomaterials: Env...
