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Accelerating Technology Transition
Accelerating the transition of new technologies into systems and products will be crucial to the Department of Defenses development of a lighter, more flexible fighting force. Current long transition times-ten years or more is now typical-are attributed to the complexity of the process. To help meet these challenges, the Department of Defense asked the National Research Council to examine lessons learned from rapid technology applications by integrated design and manufacturing groups. This report presents the results of that study, which was based on a workshop held to explore these successful cases. Three key areas emerged: creating a culture for innovation and rapid technology transition; methodologies and approaches; and enabling tools and databases.
Science of Sintering
This volume, SCIENCE OF SINTERING: NEW DIRECTIONS FOR MATERIALS PROCESSING AND MICROSTRUCTURAL CONTROL, contains the edited Proceedings of the Seventh World Round Table Conference on Sintering, held in Herceg-Novi, Yugoslavia, Aug. 28 - Sept. 1, 1989. It was organized by the International Institute for the Science of Sintering (IISS), headquartered in Belgrade, Yugoslavia. Every fourth year since 1969, the Institute has organized such a Round Table Conference on Sintering; each has taken place at some selected location within Yugoslavia. A separate series of IISS Topical Sintering Symposia (Summer Schools) have also been held at four year intervals, but they have been offset by about two yea...
Interim Report on the Second Triennial Review of the National Nanotechnology Initiative
Nanotechnology has become one of the defining ideas in global R&D over the past decade. In 2001 the National Nanotechnology Initiative (NNI) was established as the U.S. government interagency program for coordinating nanotechnology research and development across deferral agencies and facilitating communication and collaborative activities in nanoscale science, engineering, and technology across the federal government. The 26 federal agencies that participate in the NNI collaborate to (1) advance world-class nanotechnology research and development; (2) foster the transfer of new technologies into products for commercial and public benefit; (3) develop and sustain educational resources, a ski...
Review of the Bureau of Reclamation's Corrosion Prevention Standards for Ductile Iron Pipe
Ductile iron pipe (DIP) was introduced about 50 years ago as a more economical and better-performing product for water transmission and distribution. As with iron or steel pipes, DIP is subject to corrosion, the rate of which depends on the environment in which the pipe is placed. Corrosion mitigation protocols are employed to slow the corrosion process to an acceptable rate for the application. When to use corrosion mitigation systems, and which system, depends on the corrosivity of the soils in which the pipeline is buried. The Bureau of Reclamation's specification for DIP in highly corrosive soil has been contested by some as an overly stringent requirement, necessitating the pipe to be m...
Guide to NIST
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Guide to NIST (National Institute of Standards and Technology)
Gathers in one place descriptions of NIST's many programs, products, services, and research projects, along with contact names, phone numbers, and e-mail and World Wide Web addresses for further information. It is divided into chapters covering each of NIST's major operating units. In addition, each chapter on laboratory programs includes subheadings for NIST organizational division or subject areas. Covers: electronics and electrical engineering; manufacturing engineering; chemical science and technology; physics; materials science and engineering; building and fire research and information technology.
Diffusion Phenomena in Thin Films and Microelectronic Materials
A comprehensive review of diffusion phenomena in thin films and microelectronic materials -- theory and technology.
Ceramic Source
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Lead-Free Soldering in Electronics
Assessing the scientific and technological aspects of lead-free soldering, Lead-Free Soldering in Electronics considers the necessary background and requirements for proper alloy selection. It highlights the metallurgical and mechanical properties; plating and processing technologies; and evaluation methods vital to the production of lead-free solders in electronics. A valuable resource for those interested in promoting environmentally-conscious electronic packaging practices! Responding to increasing environmental and health concerns over lead toxicity, Lead-Free Soldering in Electronics discusses: Soldering inspection and design Mechanical evaluation in electronics Lead-free solder paste and reflow soldering Wave soldering Plating lead-free soldering in electronics Lead-Free Soldering in Electronics will benefit manufacturing, electronics, and mechanical engineers, as well as undergraduate and graduate students in these disciplines.
Electrochemical Technology Applications in Electronics
The symposium was jointly held by the US and Japanese societies, but drew participants from companies, universities, and research institutes in 12 countries. The 47 papers cover high density packaging and related technologies, electronic devices and related materials and processes, micro-electromechanical systems and microfabrication, magnetic materials and devices, and fundamental studies on the materials for electrochemical technology applications. Nearly half of them, 23, were invited. Annotation copyrighted by Book News Inc., Portland, OR.
