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System Level ESD Co-Design
  • Language: en
  • Pages: 424

System Level ESD Co-Design

An effective and cost efficient protection of electronic system against ESD stress pulses specified by IEC 61000-4-2 is paramount for any system design. This pioneering book presents the collective knowledge of system designers and system testing experts and state-of-the-art techniques for achieving efficient system-level ESD protection, with minimum impact on the system performance. All categories of system failures ranging from 'hard' to 'soft' types are considered to review simulation and tool applications that can be used. The principal focus of System Level ESD Co-Design is defining and establishing the importance of co-design efforts from both IC supplier and system builder perspective...

Wireless Sensor Networks
  • Language: en
  • Pages: 360

Wireless Sensor Networks

  • Type: Book
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  • Published: 2003-08-26
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  • Publisher: CRC Press

Because they provide practical machine-to-machine communication at a very low cost, the popularity of wireless sensor networks is expected to skyrocket in the next few years, duplicating the recent explosion of wireless LANs. Wireless Sensor Networks: Architectures and Protocols describes how to build these networks, from the layers of the

Modeling of Electrical Overstress in Integrated Circuits
  • Language: en
  • Pages: 165

Modeling of Electrical Overstress in Integrated Circuits

Electrical overstress (EOS) and Electrostatic discharge (ESD) pose one of the most dominant threats to integrated circuits (ICs). These reliability concerns are becoming more serious with the downward scaling of device feature sizes. Modeling of Electrical Overstress in Integrated Circuits presents a comprehensive analysis of EOS/ESD-related failures in I/O protection devices in integrated circuits. The design of I/O protection circuits has been done in a hit-or-miss way due to the lack of systematic analysis tools and concrete design guidelines. In general, the development of on-chip protection structures is a lengthy expensive iterative process that involves tester design, fabrication, tes...

Hot Carrier Design Considerations for MOS Devices and Circuits
  • Language: en
  • Pages: 345

Hot Carrier Design Considerations for MOS Devices and Circuits

As device dimensions decrease, hot-carrier effects, which are due mainly to the presence of a high electric field inside the device, are becoming a major design concern. On the one hand, the detrimental effects-such as transconductance degradation and threshold shift-need to be minimized or, if possible, avoided altogether. On the other hand, performance such as the programming efficiency of nonvolatile memories or the carrier velocity inside the devices-need to be maintained or improved through the use of submicron technologies, even in the presence of a reduced power supply. As a result, one of the major challenges facing MOS design engineers today is to harness the hot-carrier effects so ...

ESD in Silicon Integrated Circuits
  • Language: en
  • Pages: 434

ESD in Silicon Integrated Circuits

* Examines the various methods available for circuit protection, including coverage of the newly developed ESD circuit protection schemes for VLSI circuits. * Provides guidance on the implementation of circuit protection measures. * Includes new sections on ESD design rules, layout approaches, package effects, and circuit concepts. * Reviews the new Charged Device Model (CDM) test method and evaluates design requirements necessary for circuit protection.

ESD Design Challenges and Strategies in Deeply-scaled Integrated Circuits
  • Language: en
  • Pages: 137

ESD Design Challenges and Strategies in Deeply-scaled Integrated Circuits

It is the main objective of this work to address the scaling and design challenges of ESD protection in deeply scaled technologies. First, the thesis introduces the on-chip ESD events, the scaling and design challenges, and the nomenclatures necessary for later chapters. The ESD design window and the I/O schematics for both rail clamping and local clamping ESD schemes are illustrated. Then, the thesis delves into the investigation of the input and output driver devices and examines their robustness under ESD. The input driver's oxide breakdown levels are evaluated in deeply scaled technologies. The output driver's trigger and breakdown voltages are improved appreciably by applying circuit an...

Analog BiCMOS Design
  • Language: en
  • Pages: 232

Analog BiCMOS Design

  • Type: Book
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  • Published: 2018-10-08
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  • Publisher: CRC Press

Integrated circuits (ICs) don't always work the first time. Many things can and do go wrong in analog circuit designs. There are a number of common errors that often require costly chip redesign and refabrication, all of which can be avoided when designers are aware of the pitfalls. To realize success, IC designers need a complete toolbox-a toolbox filled not only with a solid background in electronics, design concepts and analysis skills, but also with the most valuable tool of all: experience. Analog BiCMOS Design offers IC design engineers the learning equivalent to decades of practical experience. Culled from the careers of practicing engineers, it presents the most effective methods and...

Electrical Overstress/Electrostatic Discharge Symposium Proceedings
  • Language: en
  • Pages: 448

Electrical Overstress/Electrostatic Discharge Symposium Proceedings

  • Type: Book
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  • Published: 2004
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  • Publisher: Unknown

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Official Gazette of the United States Patent and Trademark Office
  • Language: en
  • Pages: 1464

Official Gazette of the United States Patent and Trademark Office

  • Type: Book
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  • Published: 2002
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  • Publisher: Unknown

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Official Gazette of the United States Patent and Trademark Office
  • Language: en
  • Pages: 1138

Official Gazette of the United States Patent and Trademark Office

  • Type: Book
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  • Published: 1999
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  • Publisher: Unknown

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