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This book discusses the application of quality and reliability engineering in Asian industries, and offers information for multinational companies (MNC) looking to transfer some of their operation and manufacturing capabilities to Asia and at the same time maintain high levels of reliability and quality. It is also provides small and medium enterprises (SME) in Asia with insights into producing high-quality and reliable products. It mainly comprises peer-reviewed papers that were presented at the Asian Network for Quality (ANQ) Congress 2014 held in Singapore (August, 2014), which provides a platform for companies, especially those within Asia where rapid changes and growth in manufacturing are taking place, to present their quality and reliability practices. The book presents practical demonstrations of how quality and reliability methodologies can be modified for the unique Asian market, and as such is a valuable resource for students, academics, professionals and practitioners in the field of quality and reliability.
Compact Hierarchical Bipolar Transistor Modeling with HICUM will be of great practical benefit to professionals from the process development, modeling and circuit design community who are interested in the application of bipolar transistors, which include the SiGe:C HBTs fabricated with existing cutting-edge process technology. The book begins with an overview on the different device designs of modern bipolar transistors, along with their relevant operating conditions; while the subsequent chapter on transistor theory is subdivided into a review of mostly classical theories, brought into context with modern technology, and a chapter on advanced theory that is required for understanding modern device designs. This book aims to provide a solid basis for the understanding of modern compact models.
This book presents the art of advanced MOSFET modeling for integrated circuit simulation and design. It provides the essential mathematical and physical analyses of all the electrical, mechanical and thermal effects in MOS transistors relevant to the operation of integrated circuits. Particular emphasis is placed on how the BSIM model evolved into the first ever industry standard SPICE MOSFET model for circuit simulation and CMOS technology development. The discussion covers the theory and methodology of how a MOSFET model, or semiconductor device models in general, can be implemented to be robust and efficient, turning device physics theory into a production-worthy SPICE simulation model. Special attention is paid to MOSFET characterization and model parameter extraction methodologies, making the book particularly useful for those interested or already engaged in work in the areas of semiconductor devices, compact modeling for SPICE simulation, and integrated circuit design.
This book joins and integrates ceramics and ceramic-based materials in various sectors of technology. A major imperative is to extract scientific information on joining and integration response of real, as well as model, material systems currently in a developmental stage. This book envisions integration in its broadest sense as a fundamental enabling technology at multiple length scales that span the macro, millimeter, micrometer and nanometer ranges. Consequently, the book addresses integration issues in such diverse areas as space power and propulsion, thermoelectric power generation, solar energy, micro-electro-mechanical systems (MEMS), solid oxide fuel cells (SOFC), multi-chip modules, prosthetic devices, and implanted biosensors and stimulators. The engineering challenge of designing and manufacturing complex structural, functional, and smart components and devices for the above applications from smaller, geometrically simpler units requires innovative development of new integration technology and skillful adaptation of existing technology.
We may be standing on the precipice of a revolution in propulsion not seen since the internal combustion engine replaced the horse and buggy. The anticipated proliferation of electric cars will influence the daily lives of motorists, the economies of different countries and regions, urban air quality and global climate change. If you want to understand how quickly the transition is likely to occur, and the factors that will influence the predictions of the pace of the transition, this book will be an illuminating read.
With its in-depth exploration of the close connection between microelectronics, AI, and VLSI technology, this book offers valuable insights into the cutting-edge techniques and tools used in VLSI design automation, making it an essential resource for anyone seeking to stay ahead in the rapidly evolving field of VLSI design. Very large-scale integration (VLSI) is the inter-disciplinary science of utilizing advanced semiconductor technology to create various functions of computer system. This book addresses the close link of microelectronics and artificial intelligence (AI). By combining VLSI technology, a very powerful computer architecture confinement is possible. To overcome problems at dif...
This book constitutes the refereed proceedings of the Third International Conference on Information, Communication and Computing Technology, ICICCT 2018, held in New Delhi, India, in May 2018. The 18 revised full papers presented in this volume were carefully reviewed and selected from 295 submissions. The papers are organized in topical sections on communication and network systems and emerging computing technologies.
Would you like to add the capabilities of the Non-Volatile Memory (NVM) as a storage element in your silicon integrated logic circuits, and as a trimming sector in your high voltage driver and other silicon integrated analog circuits? Would you like to learn how to embed the NVM into your silicon integrated circuit products to improve their performance? This book is written to help you. It provides comprehensive instructions on fabricating the NVM using the same processes you are using to fabricate your logic integrated circuits. We at our eMemory company call this technology the embedded Logic NVM. Because embedded Logic NVM has simple fabrication processes, it has replaced the conventional...
Nanomaterials have supported humankind’s advancement, becoming one of the most important industry sectors, and are expected to rise to the top by 2030. However, significant challenges must be overcome, such as the performance and efficiency of the material under different environmental conditions. This book seeks to promote a critical view on using nanomaterials under extreme conditions found in our body, planet, and outer space. Therefore, nanomaterials are covered from multiple points of view, allowing the reader to get an enriching presentation of current knowledge on nanomaterials, limitations, advancements, and applications under extreme conditions.
The book "Cutting Edge Research in New Technologies" presents the contributions of some researchers in modern fields of technology, serving as a valuable tool for scientists, researchers, graduate students and professionals. The focus is on several aspects of designing and manufacturing, examining complex technical products and some aspects of the development and use of industrial and service automation. The book covered some topics as it follows: manufacturing, machining, textile industry, CAD/CAM/CAE systems, electronic circuits, control and automation, electric drives, artificial intelligence, fuzzy logic, vision systems, neural networks, intelligent systems, wireless sensor networks, environmental technology, logistic services, transportation, intelligent security, multimedia, modeling, simulation, video techniques, water plant technology, globalization and technology. This collection of articles offers information which responds to the general goal of technology - how to develop manufacturing systems, methods, algorithms, how to use devices, equipments, machines or tools in order to increase the quality of the products, the human comfort or security.