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Ultra-Fine Particles
  • Language: en
  • Pages: 469

Ultra-Fine Particles

  • Type: Book
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  • Published: 1995-12-31
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  • Publisher: Elsevier

This book was written with several objectives in mind: 1. To share with as many scientists and engineers as possible the intriguing scientific aspects of ultra-fine particles (UFPs) and to show their potential as new materials. 2. Entice such researchers to participate in the development of this emerging field. 3. To publicize the achievements of the Ultra-Fine Particle Project, which was carried out under the auspices of the Exploratory Research for Advanced Technology program (ERATO). In addition to the members of the Ultra-Fine Particle Project, contributions from other pioneers in this field are included. To achieve the first objective described above, the uniformity of the contents and focus on a single central theme have been sacrificed somewhat to provide a broad coverage. It is expected that the reader can discover an appropriate topic for further development of new materials and basic technology by reading selected sections of this book. Alternately, one may gain an overview of this new field by reviewing the entire book, which can potentially lead to new directions in the development of UFPs.

Official Gazette of the United States Patent Office
  • Language: en
  • Pages: 1846

Official Gazette of the United States Patent Office

  • Type: Book
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  • Published: 1969
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  • Publisher: Unknown

None

Tribology of Abrasive Machining Processes
  • Language: en
  • Pages: 753

Tribology of Abrasive Machining Processes

  • Type: Book
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  • Published: 2004-05-26
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  • Publisher: Elsevier

Recent and radically improved machining processes, from high wheel speeds to nanotechnology, have turned a spotlight on abrasive machining processes as a fertile area for further advancements. Written for researchers, students, engineers and technicians in manufacturing, this book presents a fundamental rethinking of important tribological elements of abrasive machining processes and their effects on process efficiency and product quality. Newer processes such as chemical mechanical polishing (CMP) and silicon wafer dicing can be better understood as tribological processes. Understanding the tribological principles of abrasive processes is crucial to discovering improvements in accuracy, production rate, and surface quality of products spanning all industries, from machine parts to ball bearings to contact lens to semiconductors.

Coating Materials for Electronic Applications
  • Language: en
  • Pages: 553

Coating Materials for Electronic Applications

This first book in the Materials and Processes for Electronics Applications series answers questions vital to the successful design and manufacturing of electronic components, modules, and systems such as: - How can one protect electronic assemblies from prolonged high humidity, high temperatures, salt spray or other terrestrial and space environments? - What coating types can be used to protect microelectronics in military, space, automotive, or medical environments? - How can the chemistry of polymers be correlated to desirable physical and electrical properties? - How can a design engineer avoid subsequent potential failures due to corrosion, metal migration, electrical degradation, outga...

Scientific Information Bulletin
  • Language: en
  • Pages: 708

Scientific Information Bulletin

  • Type: Book
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  • Published: 1993
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  • Publisher: Unknown

None

Handbook of Hydrothermal Technology
  • Language: en
  • Pages: 898

Handbook of Hydrothermal Technology

Quartz, zeolites, gemstones, perovskite type oxides, ferrite, carbon allotropes, complex coordinated compounds and many moreùall products now being produced using hydrothermal technology. Handbook of Hydrothermal Technology brings together the latest techniques in this rapidly advancing field in one exceptionally useful, long-needed volume. The handbook provides a single source for understanding how aqueous solvents or mineralizers work under temperature and pressure to dissolve and recrystallize normally insoluble materials, and decompose or recycle any waste material. The result, as the authors show in the book, is technologically the most efficient method in crystal growth, materials pro...

Hermeticity of Electronic Packages
  • Language: en
  • Pages: 417

Hermeticity of Electronic Packages

  • Type: Book
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  • Published: 2000-03-01
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  • Publisher: Elsevier

This is a book about the integrity of sealed packages to resist foreign gases and liquids penetrating the seal or an opening (crack) in the package—especially critical to the reliability and longevity of electronics. The author explains how to predict the reliability and the longevity of the packages based on leak rate measurements and the assumptions of impurities. Non-specialists in particular will benefit from the author's long involvement in the technology. Hermeticity is a subject that demands practical experience, and solving one problem does not necessarily give one the background to solve another. Thus, the book provides a ready reference to help deal with day to day issues as they...

Hybrid Microcircuit Technology Handbook
  • Language: en
  • Pages: 603

Hybrid Microcircuit Technology Handbook

  • Type: Book
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  • Published: 1998-12-31
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  • Publisher: Elsevier

The Hybrid Microcircuit Technology Handbook integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis. In addition to thin films, thick films, and assembly processes, important chapters on substrate selections, handling (including electrostatic discharge), failure analysis, and documentation are included. A comprehensive chapter of design guidelines will be of value to materials and process engineers, chemists, and electrical engineers who design and test hybrid circuits.

Processing of 'Wide Band Gap Semiconductors
  • Language: en
  • Pages: 593

Processing of 'Wide Band Gap Semiconductors

Wide bandgap semiconductors, made from such materials as GaN, SiC, diamond, and ZnSe, are undergoing a strong resurgence in recent years, principally because of their direct bandgaps, which give them a huge advantage over the indirect gap Sic As an example, more than 10 million blue LEDs using this technology are sold each month, and new, high brightness (15 lumens per watt), long-life white LEDs are under development with the potential to replace incandescent bulbs in many situations. This book provides readers with a broad overview of this rapidly expanding technology, bringing them up to speed on new discoveries and commercial applications. It provides specific technical applications of key processes such as laser diodes, LEDs, and very high temperature electronic controls on engines, focusing on doping, etching, oxidation passivation, growth techniques and more.

Ultrananocrystalline Diamond
  • Language: en
  • Pages: 621

Ultrananocrystalline Diamond

Ultrananocrystalline Diamond: Syntheses, Properties, and Applications is a unique practical reference handbook that brings together the basic science of nanoscale carbon structures, particularly its diamond phase, with detailed information on nanodiamond synthesis, properties, and applications. Here you will learn about UNCD in its two forms, as a dispersed powder made by detonation techniques and as a chemical vapor deposited film. You will also learn about the superior mechanical, tribological, transport, electrochemical, and electron emission properties of UNCD for a wide range of applications including MEMS, NEMS, surface acoustic wave (SAW) devices, electrochemical sensors, coatings for field emission arrays, photonic and RF switching, biosensors, and neural prostheses, and more. This ôEverything about Ultra-nanocrystalline Diamondö book with 16 chapters is written by leading experts worldwide. It is for everyone who researches carbon nanostructures, everyone who produces them, everyone who characterizes them, and everyone who builds devices using them.