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Computational Methods for Microstructure-Property Relationships
Computational Methods for Microstructure-Property Relationships introduces state-of-the-art advances in computational modeling approaches for materials structure-property relations. Written with an approach that recognizes the necessity of the engineering computational mechanics framework, this volume provides balanced treatment of heterogeneous materials structures within the microstructural and component scales. Encompassing both computational mechanics and computational materials science disciplines, this volume offers an analysis of the current techniques and selected topics important to industry researchers, such as deformation, creep and fatigue of primarily metallic materials. Researchers, engineers and professionals involved with predicting performance and failure of materials will find Computational Methods for Microstructure-Property Relationships a valuable reference.
Mechanics of Dislocation Fields
Accompanying the present trend of engineering systems aimed at size reduction and design at microscopic/nanoscopic length scales, Mechanics of Dislocation Fields describes the self-organization of dislocation ensembles at small length scales and its consequences on the overall mechanical behavior of crystalline bodies. The account of the fundamental interactions between the dislocations and other microscopic crystal defects is based on the use of smooth field quantities and powerful tools from the mathematical theory of partial differential equations. The resulting theory is able to describe the emergence of dislocation microstructures and their evolution along complex loading paths. Scale transitions are performed between the properties of the dislocation ensembles and the mechanical behavior of the body. Several variants of this overall scheme are examined which focus on dislocation cores, electromechanical interactions of dislocations with electric charges in dielectric materials, the intermittency and scale-invariance of dislocation activity, grain-to-grain interactions in polycrystals, size effects on mechanical behavior and path dependence of strain hardening.
Generalized Continua as Models for Classical and Advanced Materials
This volume is devoted to an actual topic which is the focus world-wide of various research groups. It contains contributions describing the material behavior on different scales, new existence and uniqueness theorems, the formulation of constitutive equations for advanced materials. The main emphasis of the contributions is directed on the following items - Modelling and simulation of natural and artificial materials with significant microstructure, - Generalized continua as a result of multi-scale models, - Multi-field actions on materials resulting in generalized material models, - Theories including higher gradients, and - Comparison with discrete modelling approaches
Differential Geometry and Continuum Mechanics
This book examines the exciting interface between differential geometry and continuum mechanics, now recognised as being of increasing technological significance. Topics discussed include isometric embeddings in differential geometry and the relation with microstructure in nonlinear elasticity, the use of manifolds in the description of microstructure in continuum mechanics, experimental measurement of microstructure, defects, dislocations, surface energies, and nematic liquid crystals. Compensated compactness in partial differential equations is also treated. The volume is intended for specialists and non-specialists in pure and applied geometry, continuum mechanics, theoretical physics, materials and engineering sciences, and partial differential equations. It will also be of interest to postdoctoral scientists and advanced postgraduate research students. These proceedings include revised written versions of the majority of papers presented by leading experts at the ICMS Edinburgh Workshop on Differential Geometry and Continuum Mechanics held in June 2013. All papers have been peer reviewed.
Silicon, From Sand to Chips, Volume 1
Silicon is the material of the digital revolution, of solar energy and of digital photography, which has revolutionized both astronomy and medical imaging. It is also the material of microelectromechanical systems (MEMS), indispensable components of smart objects. The discovery of the electronic and optoelectronic properties of germanium and silicon during the Second World War, followed by the invention of the transistor, ushered in the digital age. Although the first transistors were made from germanium, silicon eventually became the preferred material for these technologies. Silicon, From Sand to Chips 1 traces the history of the discoveries, inventions and developments in basic components and chips that these two materials enabled one after the other. The book is divided into two volumes and this first volume is devoted to basic microelectronic components.
Crystal Elasticity
This book is an original and timeless description of the elasticity of solids, and more particularly of crystals, covering all aspects from theory and elastic constants to experimental moduli. The first part is dedicated to a phenomenological and dimensionless representation of macroscopic crystal elasticity, which allows us to compare all crystals of the same symmetry with the concept of anisotropy and to establish new relations between elastic constants. Multi-scale approaches are then put forward to describe the elasticity at an atomic scale or for polycrystals. The relationship between elasticity and structural or physical properties is illustrated by many experimental data. The second part is entirely devoted to a Lagrangian theory of vibrations and its application to the characterization of elasticity by means of the dynamic resonant method. This unique approach applied to tensioncompression, flexural and torsional tests allows for an accurate determination of elastic moduli of structural and functional crystals, varying from bulk to multi-coated materials
Light Weight Materials
In the automotive and aerospace industries, the need for strong yet light materials has given rise to extensive research into aluminum and magnesium alloys and formable titanium alloys. All of these are categorized as light weight materials. The distinguishing feature of light weight materials is that they are low density, but they have a wide range of properties and, as a result, a wide range of applications. This book provides researchers and students with an overview of the recent advancements in light weight material processing, manufacturing and characterization. It contains chapters by eminent researchers on topics associated with light weight materials, including on the current buzzword “composite materials”. First, this book describes the current status of light weight materials. Then, it studies applications of these materials, given that, as the densities vary, so do the applications, ranging from automobiles and aviation to bio-mechatronics. This book will therefore serve as an excellent guide to this field.
Silicon, From Sand to Chips, Volume 2
Silicon is the material of the digital revolution, of solar energy and of digital photography, which has revolutionized both astronomy and medical imaging. It is also the material of microelectromechanical systems (MEMS), indispensable components of smart objects. The discovery of the electronic and optoelectronic properties of germanium and silicon during the Second World War, followed by the invention of the transistor, ushered in the digital age. Although the first transistors were made from germanium, silicon eventually became the preferred material for these technologies. Silicon, From Sand to Chips 2 traces the history of the discoveries, inventions and developments in basic components and chips that these two materials enabled one after the other. The book is divided into two volumes and this second volume is devoted to microelectronic and optoelectronic chips, solar cells and MEMS.
Thermal Properties Measurement of Materials
The control of energy in the industrial sector and the reduction of consumption in the building sector will be key elements in the energy transition. In order to achieve these objectives it is necessary to use materials with energy performance adapted to their use as well as insulators or super-insulators. In both cases, a thorough knowledge of their thermal properties will be required for optimal success. This revised and updated 2nd edition of Thermal Properties Measurement of Materials enables the reader to choose the measurement method best suited to the material they are characterizing and provides all of the information required in order to implement it with maximum precision. This work is intended to be accessible to anyone who needs to measure the thermal properties of a material, whether or not they are a thermal engineer.
