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Electroless Copper and Nickel-Phosphorus Plating
Unlike electroplating, electroless plating allows uniform deposits of coating materials over all surfaces, regardless of size, shape and electrical conductivity. Electroless copper and nickel-phosphorus deposits provide protective and functional coatings in industries as diverse as electronics, automotive, aerospace and chemical engineering. This book discusses the latest research in electroless depositions.After an introductory chapter, part one focuses on electroless copper depositions reviewing such areas as surface morphology and residual stress, modelling surface structure, adhesion strength of electroless copper deposit, electrical resistivity and applications of electroless copper dep...
Copper Electrodeposition for Nanofabrication of Electronics Devices
This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: • ULSI wiring material based upon copper nanowiring • Printed circuit boards • Stacked semiconductors • Through Silicon Via • Smooth copper foil for Lithium-Ion battery electrodes. This book is ideal for nanotechnologists, industry professionals, and practitioners.
Copper Plate Photogravure
First Published in 2003. Routledge is an imprint of Taylor & Francis, an informa company.
ART OF GOLD SILVER NICKEL & CO
This work has been selected by scholars as being culturally important, and is part of the knowledge base of civilization as we know it. This work was reproduced from the original artifact, and remains as true to the original work as possible. Therefore, you will see the original copyright references, library stamps (as most of these works have been housed in our most important libraries around the world), and other notations in the work. This work is in the public domain in the United States of America, and possibly other nations. Within the United States, you may freely copy and distribute this work, as no entity (individual or corporate) has a copyright on the body of the work. As a reproduction of a historical artifact, this work may contain missing or blurred pages, poor pictures, errant marks, etc. Scholars believe, and we concur, that this work is important enough to be preserved, reproduced, and made generally available to the public. We appreciate your support of the preservation process, and thank you for being an important part of keeping this knowledge alive and relevant.
Suggested Method for Plating Copper on Aluminum
The report describes the successful application of the phosphate anodizing process in copper plating commercially pure aluminum and several aluminum alloys; it also lists the advantages-as well as one disadvantage compared with the zincate process in current use by industry.
