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Shreir's Corrosion
  • Language: en
  • Pages: 3652

Shreir's Corrosion

  • Type: Book
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  • Published: 2009-02-27
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  • Publisher: Elsevier

This four-volume reference work builds upon the success of past editions of Elsevier’s Corrosion title (by Shreir, Jarman, and Burstein), covering the range of innovations and applications that have emerged in the years since its publication. Developed in partnership with experts from the Corrosion and Protection Centre at the University of Manchester, Shreir’s Corrosion meets the research and productivity needs of engineers, consultants, and researchers alike. Incorporates coverage of all aspects of the corrosion phenomenon, from the science behind corrosion of metallic and non-metallic materials in liquids and gases to the management of corrosion in specific industries and applications Features cutting-edge topics such as medical applications, metal matrix composites, and corrosion modeling Covers the benefits and limitations of techniques from scanning probes to electrochemical noise and impedance spectroscopy

Handbook of Science & Engineering of Green Corrosion Inhibitors
  • Language: en
  • Pages: 286

Handbook of Science & Engineering of Green Corrosion Inhibitors

  • Type: Book
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  • Published: 2021-11-25
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  • Publisher: Elsevier

Handbook of Science and Engineering of Green Corrosion Inhibitors: Modern Theory, Fundamentals and Practical Applications presents developments in green corrosion inhibitors and current applications. The book provides an overview of green corrosion inhibitors such as plant extracts, chemical medicines, natural polymers, synthetic green compounds, carbohydrates, amino acids and oleochemicals that can cost-effectively minimize corrosive damage. The book handles several compounds used as anticorrosive materials for different metals and alloys in a versatile corrosive environment. Sections address the fundamental characteristics of green corrosion inhibition and deal with the economic impact of ...

Meeting Abstracts
  • Language: en
  • Pages: 1590

Meeting Abstracts

  • Type: Book
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  • Published: 2002
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  • Publisher: Unknown

None

Bulgarian Chemical Communications
  • Language: en
  • Pages: 762

Bulgarian Chemical Communications

  • Type: Book
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  • Published: 1994
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  • Publisher: Unknown

None

Corrosion Control for Low-cost Reliability
  • Language: en
  • Pages: 268

Corrosion Control for Low-cost Reliability

None

Corrosion and Protection of Light Metal Alloys
  • Language: en
  • Pages: 428

Corrosion and Protection of Light Metal Alloys

"These proceedings represent contributions to the Symposium on the Corrosion and Protection of Light Metals, held at the 204th Meeting of the Electrochemical Society, October 12th through 17th, 2003, in Orlando, Florida."--P. iii.

The Argentine Economy
  • Language: en
  • Pages: 252

The Argentine Economy

Argentina poses a challenge to economists, economic historians, political scientists, and other concerned with the interrelationship of political and economic forces in developing nations. Although possessed of most of the attributes generally thought necessary for rapid and self-sustaining development, her economy has barely kept up with the population increase, and living standards of large segments of the population have not advanced. The causes of this paradox have never been adequately explained. Ferrer interprets the economic stagnation of Argentina in historical terms, tracing the evolution of the country's economy through four separate stages, beginning with the colonial era in the s...

Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication
  • Language: en
  • Pages: 327

Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication

Chemical mechanical planarization, or chemical mechanical polishing as it is simultaneously referred to, has emerged as one of the critical processes in semiconductor manufacturing and in the production of other related products and devices, MEMS for example. Since its introduction some 15+ years ago CMP, as it is commonly called, has moved steadily into new and challenging areas of semiconductor fabrication. Demands on it for consistent, efficient and cost-effective processing have been steady. This has continued in the face of steadily decreasing feature sizes, impressive increases in wafer size and a continuing array of new materials used in devices today. There are a number of excellent ...