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As systems continue to evolve they rely less on human decision-making and more on computational intelligence. This trend in conjunction to the available technologies for providing advanced sensing, measurement, process control, and communication lead towards the new field of Cyber-Physical System (CPS). Cyber-physical systems are expected to play a major role in the design and development of future engineering platforms with new capabilities that far exceed today’s levels of autonomy, functionality and usability. Although these systems exhibit remarkable characteristics, their design and implementation is a challenging issue, as numerous (heterogeneous) components and services have to be a...
Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.
VLSI 2010 Annual Symposium will present extended versions of the best papers presented in ISVLSI 2010 conference. The areas covered by the papers will include among others: Emerging Trends in VLSI, Nanoelectronics, Molecular, Biological and Quantum Computing. MEMS, VLSI Circuits and Systems, Field-programmable and Reconfigurable Systems, System Level Design, System-on-a-Chip Design, Application-Specific Low Power, VLSI System Design, System Issues in Complexity, Low Power, Heat Dissipation, Power Awareness in VLSI Design, Test and Verification, Mixed-Signal Design and Analysis, Electrical/Packaging Co-Design, Physical Design, Intellectual property creating and sharing.
The implementation of networks-on-chip (NoC) technology in VLSI integration presents a variety of unique challenges. To deal with specific design solutions and research hurdles related to intra-chip data exchange, engineers are challenged to invoke a wide range of disciplines and specializations while maintaining a focused approach. Leading Researchers Present Cutting-Edge Designs Tools Networks-on-Chips: Theory and Practice facilitates this process, detailing the NoC paradigm and its benefits in separating IP design and functionality from chip communication requirements and interfacing. It starts with an analysis of 3-D NoC architectures and progresses to a discussion of NoC resource alloca...
This book constitutes the proceedings of the 15th International Symposium on Applied Reconfigurable Computing, ARC 2019, held in Darmstadt, Germany, in April 2019. The 20 full papers and 7 short papers presented in this volume were carefully reviewed and selected from 52 submissions. In addition, the volume contains 1 invited paper. The papers were organized in topical sections named: Applications; partial reconfiguration and security; image/video processing; high-level synthesis; CGRAs and vector processing; architectures; design frameworks and methodology; convolutional neural networks.
This book constitutes the refereed proceedings of the 4th International Workshop on Systems, Architectures, Modeling, and Simulation, SAMOS 2004, held in Samos, Greece on July 2004. Besides the SAMOS 2004 proceedings, the book also presents 19 revised papers from the predecessor workshop SAMOS 2003. The 55 revised full papers presented were carefully reviewed and selected for inclusion in the book. The papers are organized in topical sections on reconfigurable computing, architectures and implementation, and systems modeling and simulation.
This book constitutes the refereed proceedings of the 19th International Conference on Embedded Computer Systems: Architectures, Modeling, and Simulation, SAMOS 2019, held in Pythagorion, Samos, Greece, in July 2019. The 21 regular papers presented were carefully reviewed and selected from 55 submissions. The papers are organized in topical sections on system design space exploration; deep learning optimization; system security; multi/many-core scheduling; system energy and heat management; many-core communication; and electronic system-level design and verification. In addition there are 13 papers from three special sessions which were organized on topics of current interest: insights from negative results; machine learning implementations; and European projects.
Reinforcement learning (RL) will deliver one of the biggest breakthroughs in AI over the next decade, enabling algorithms to learn from their environment to achieve arbitrary goals. This exciting development avoids constraints found in traditional machine learning (ML) algorithms. This practical book shows data science and AI professionals how to learn by reinforcementand enable a machine to learn by itself. Author Phil Winder of Winder Research covers everything from basic building blocks to state-of-the-art practices. You'll explore the current state of RL, focus on industrial applications, learnnumerous algorithms, and benefit from dedicated chapters on deploying RL solutions to productio...
This book contains extended and revised versions of the best papers presented at the 25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, held in Abu Dhabi, United Arab Emirates, in August 2017. The 11 papers included in this book were carefully reviewed and selected from the 33 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the latest scientific and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) Design. On the occasion of the silver jubilee of the VLSI-SoC conference series the book also includes a special chapter that presents the history of the VLSI-SoC series of conferences and its relation with VLSI-SoC evolution since the early 80s up to the present.
Welcome to the proceedings of PATMOS 2005, the 15th in a series of international workshops.PATMOS2005wasorganizedbyIMECwithtechnicalco-sponsorshipfrom the IEEE Circuits and Systems Society. Over the years, PATMOS has evolved into an important European event, where - searchers from both industry and academia discuss and investigate the emerging ch- lenges in future and contemporary applications, design methodologies, and tools - quired for the developmentof upcominggenerationsof integrated circuits and systems. The technical program of PATMOS 2005 contained state-of-the-art technical contri- tions, three invited talks, a special session on hearing-aid design, and an embedded - torial. The tec...