Welcome to our book review site go-pdf.online!
You may have to Search all our reviewed books and magazines, click the sign up button below to create a free account.
CAE - PROCESS AND NETWORK
CAE ProNet methodology is to develop CAE network considering interdependencies among digital validations. Utilizing CAE network and considering industrial requirements, an algorithm is applied to execute a product, vehicle development phase, and load case priority oriented CAE process. Major advantage of this research work is to improve quality of simulation results, reducing time-to-market and decreasing dependencies on hardware prototype.
Multigrid Methods for Process Simulation
It was about 1985 when both of the authors started their work using multigrid methods for process simulation problems. This happened in dependent from each other, with a completely different background and different intentions in mind. At this time, some important monographs appeared or have been in preparation. There are the three "classical" ones, from our point of view: the so-called "1984 Guide" [12J by Brandt, the "Multi-Grid Methods and Applications" [49J by Hackbusch and the so-called "Fundamentals" [132J by Stiiben and Trottenberg. Stiiben and Trottenberg in [132J state a "delayed acceptance, resent ments" with respect to multigrid algorithms. They complain: "Nevertheless, even today...
Modeling and Simulation of Thin-Film Processing: Volume 389
A diverse set of materials science communities come together in this volume to review the extraordinary progress made in the development of computer simulation and modeling techniques for the prediction of film morphology, microstructure, composition, profile and structure. These techniques are rapidly moving out of the area of academic research and into technological and production design areas of thin-film-based industries. The book is loosely organized in ascending order of modeling-length scales - from atomic, up to the entire deposition reactor. Topics include: deposition and growth modeling; film morphology and topology; film microstructure; failure mechanisms; etching; process modeling and control and reactor-scale modeling.
Simulation of Semiconductor Devices and Processes
The "Fifth International Conference on Simulation of Semiconductor Devices and Processes" (SISDEP 93) continues a series of conferences which was initiated in 1984 by K. Board and D. R. J. Owen at the University College of Wales, Swansea, where it took place a second time in 1986. Its organization was succeeded by G. Baccarani and M. Rudan at the University of Bologna in 1988, and W. Fichtner and D. Aemmer at the Federal Institute of Technology in Zurich in 1991. This year the conference is held at the Technical University of Vienna, Austria, September 7 - 9, 1993. This conference shall provide an international forum for the presentation of out standing research and development results in th...
